CMC01 TOSHIBA Semiconductor CORPORATION, CMC01 Datasheet
CMC01
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CMC01 Summary of contents
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... Soldering land: 2.1 mm × 1.4 mm glass-epoxy board thickness: 1.6t R ― th (j-ℓ JEDEC ― JEITA ― TOSHIBA 3-4E1A Weight: 0.023 g (typ.) Min Typ. Max ⎯ 0.86 1.0 ⎯ ⎯ 10 ⎯ ⎯ 60 ⎯ ⎯ 110 ⎯ ⎯ 180 ⎯ ⎯ 16 2006-11-06 CMC01 Unit: mm Unit V μA °C/W °C/W ...
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... Note 2 Repetitive peak forward current waveform I FRM 0.368×I FRM 0 τ τ=1ms ､ C =1000μF ､ 1puｌse/4sec M Marking Abbreviation Code Part No. C1 CMC01 Standard Soldering Pad 1.4 3.0 t Unit: mm 1.4 2 CMC01 2006-11-06 ...
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... Please refer to the Rectifiers databook for further information. curve. F (AV) . The total number of repetitive currents must be less than 5000 times FRM 3 CMC01 for an AC circuit. RRM . F(AV) 2006-11-06 ...
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... Soldering land × 0.1 0.001 0.01 0 Time t (s) 1.2 Halfsine waveform 1.0 0° 0.8 Conduction angle 180° 0.6 0.4 0.2 0.0 1.8 2.0 0.0 0.2 (V) Average forward current I F (AV) (A) Surge forward current (non-repetitive 1.0 1.2 (A) 100 1000 4 CMC01 P – (AV) F (AV) 180° 0.4 0.6 0.8 1.0 1.2 Ta=25°C f=50Hz 10 100 Number of cycles 2006-11-06 ...
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... Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 5 CMC01 20070701-EN 2006-11-06 ...