Maximum Ratings
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Features
Mechanical Data
Thermal Characteristics
Notes:
DS30477 Rev. 10 - 2
PowerDI is a trademark of Diodes Incorporated.
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
Thermal Resistance Junction to Soldering Point
Thermal Resistance Junction to Ambient Air (Note 2) T
Thermal Resistance Junction to Ambient Air (Note 3) T
Thermal Resistance Junction to Ambient Air (Note 4) T
Operating Temperature Range
Storage Temperature Range
Guard Ring Die Construction for
Transient Protection
Low Power Loss, High Efficiency
Low Reverse Leakage Current
For Use in High Frequency Inverters, Free Wheeling, and
Polarity Protection Applications
High Forward Surge Current Capability
Lead Free Finish, RoHS Compliant (Note 1)
"Green" Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
Case: PowerDI 5
Case Material: Molded Plastic, “Green” Molding
Compound. UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Marking: See Page 3
Weight: 0.096 grams (approximate)
2. FR-4 PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
3. Polymide PCB, 2 oz. Copper, minimum recommended pad layout per http://www.diodes.com/datasheets/ap02001.pdf.
4. Polymide PCB, 2 oz. Copper. Cathode pad dimensions 9.4 mm x 7.2 mm. Anode pad dimensions 2.7 mm x 1.6 mm.
1. RoHS revision 13.2.2003. High Temperature Solder Exemption Applied, see EU Directive Annex Note 7.
Characteristic
Characteristic
@ T
A
= 25 C unless otherwise specified
A
A
A
= 25 C
= 25 C
= 25 C
e
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3
1 of 3
RIGHT PIN
Note: Pins Left & Right must
LEFT PIN
L1
L1
W
Symbol
b1
b1
V
V
V
be electrically connected
at the printed circuit board.
R(RMS)
I
RWM
V
FSM
RRM
I
O
R
Symbol
D2
b2
b2
D
D
T
e
R
R
R
R
e
STG
T
7A SCHOTTKY BARRIER RECTIFIER
JS
JA
JA
JA
j
E2
b1
b1
E
L1
L
E
BOTTOMSIDE
HEAT SINK
A
E1
A2
A2
Typ
85
70
45
-65 to +150
-65 to +150
Value
275
60
42
7
Dim
All Dimensions in mm
A2
b1
b2
D2
E1
E2
L1
W
PDS760
A
D
E
e
L
Max
1.5
PowerDI 5
PowerDI 5
Diodes Incorporated
1.05
0.33
0.80
1.70
3.90
6.40
5.30
0.75
0.50
1.20
Min
3.05 NOM
1.84 NOM
3.55 NOM
Unit
PDS760
V
V
A
A
°C/W
°C/W
°C/W
Unit
Max
1.15
0.43
0.99
1.88
4.05
6.60
5.45
0.95
0.65
1.50
C/W
°C
C