T6326A ETC-unknow, T6326A Datasheet - Page 6

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T6326A

Manufacturer Part Number
T6326A
Description
Low-dropout, Constant-current White Led With Channel Control
Manufacturer
ETC-unknow
Datasheet
tm
PACKAGE DIMENSIONS
10-LEAD MSOP-10L
TM Technology Inc. reserves the right
to change products or specifications without notice.
Symbol
*Note :
PCB is soldered with thermal pad. The thermal pad enhances the power dissipation. As a result, a
large amount of current can be sunk safely in one package.
C 2
A1
B1
C1
C2
A
B
C
D
K
H
E
F
J
The thermal pad on the IC’s bottom has to be mounted on the copper foil.
To eliminate the noise influence, the thermal pad is suggested to be connected to GND on PCB.
In addition, desired thermal conductivity will be improved, if a heat-conducting copper foil on
B 1
Min.
0.75
0.00
0.17
0.40
0.10
CH
TE
-
-
-
-
-
-
-
T h e rm a l P a d *
B
Dimension in mm
K
D
1.715 REF
1.600 REF
Typ.
4.90
3.00
3.00
0.50
0.85
0.60
0.15
0~8°
-
-
-
J
Max.
1.10
0.95
0.15
0.27
0.80
0.25
-
-
-
-
-
-
C 1
A 1
C
A
H
0.029
0.000
0.007
0.015
0.004
Min.
-
-
-
-
-
-
-
P.6
Dimension in inch
0.067 REF
0.063 REF
0~8°
0.193
0.118
0.118
0.019
0.033
0.024
0.006
Typ.
-
-
-
Max.
0.043
0.037
0.006
0.010
0.031
0.010
Preliminary T6326A
-
-
-
-
-
-
Publication Date: FEB. 2006
E
F
Revision: A

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