APR9301 Aplus Integrated circuits Inc., APR9301 Datasheet - Page 7
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APR9301
Manufacturer Part Number
APR9301
Description
Apr9301 Re-recording Voice Ic
Manufacturer
Aplus Integrated circuits Inc.
Datasheet
1.APR9301.pdf
(10 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
APR9301-V2
Manufacturer:
ATMEL
Quantity:
2 300
Table 4 Analog Characteristics ( Note 1 )
Voltage Amplitude Across SP+/-
Note 1: Typical Values: VCCD = VCCA = 5V; VSSD = VSSA = 0V; TA = 25℃
Note 2: Except pins 23 and 27 which have internal pull-up resistors.
Bonding Pad Diagram & Description of Bonding Pad Coordinates :
Figure 5 APR9301 Die Bonding Pad Diagram
http://www.aplusinc.com.tw
Total Harmonic Distortion
AGC Output Resistance
AnaIn Input Resistance
MicIn Input Resistance
SP+/- Output Power
AnaIn Input Voltage
MicIn Input Voltage
MicIn Amp Gain (1)
MicIn Amp Gain (2)
AnaIn Amp Gain
Item
INTEGRATED CIRCUITS INC.
Symbol
RAGC
GMI2
GANI
VANI
RANI
GMIl
THD
VMI
RMI
Psp
Vsp
Page
@ 1kHz & 20mVp-p input
7
Analn to SP+/-
Rsp+/- = 16Ω
Rsp+/-≧16Ω
AGC≧3.OV
AGC≦2.2V
Condition
/
--
--
--
--
--
10
Mim
--
--
--
--
--
--
--
--
--
--
*
respect to die center(um)
X=214± 1 mils(5500um)
Y=144± 1 mils(3750um)
-
Connect substrate
Die diagram is with
APR9301
12.2
1.25
Typ
Die Dimensions:
-45
to Ground.
10
24
10
22
Die Thickness:
13.8± 1.0 mils
--
--
1
1
Pad Opening:
(350± 25um)
4.3mils
110um
Notes:
Max
-15
20
50
--
--
--
--
--
--
--
VER2.3
mVp-p
mVp-p
Vp-p
Unit
mW
kΩ
kΩ
kΩ
dB
dB
dB
%