MC74ACT541DWR2G ON Semiconductor, MC74ACT541DWR2G Datasheet - Page 11

IC BUFF/DVR TRI-ST 8BIT 20SOIC

MC74ACT541DWR2G

Manufacturer Part Number
MC74ACT541DWR2G
Description
IC BUFF/DVR TRI-ST 8BIT 20SOIC
Manufacturer
ON Semiconductor
Series
74ACTr
Datasheet

Specifications of MC74ACT541DWR2G

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
8
Current - Output High, Low
24mA, 24mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Logic Family
74ACT
Number Of Channels Per Chip
Octal
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
8 uA
Low Level Output Current
24 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
3
Output Type
3-State
Propagation Delay Time
7.5 ns @ 5 V
Logical Function
Buffer/Line Driver
Number Of Elements
1
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
5V
Package Type
SOIC W
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Quiescent Current
8uA
Technology
CMOS
Pin Count
20
Mounting
Surface Mount
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74ACT541DWR2GOS
MC74ACT541DWR2GOS
MC74ACT541DWR2GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC74ACT541DWR2G
Manufacturer:
ON Semiconductor
Quantity:
2 450
0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
MC74AC540, MC74ACT540, MC74AC541, MC74ACT541
20
1
D
0.36
16X
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−V−
0.10 (0.004)
A
K
REF
G
H
M
11
10
PACKAGE DIMENSIONS
T
SOLDERING FOOTPRINT*
1
1.26
16X
U
−U−
http://onsemi.com
S
B
CASE 948E−02
DT SUFFIX
V
TSSOP−20
ISSUE C
S
7.06
11
N
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
DIMENSIONS: MILLIMETERS
K1
K
M
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
M
A
B
C
D
F
G
H
K
L
J
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
−−−
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_

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