PIC10F222 Microchip Technology Inc., PIC10F222 Datasheet - Page 79

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PIC10F222

Manufacturer Part Number
PIC10F222
Description
High-performance Microcontrollers With 8-bit A/d
Manufacturer
Microchip Technology Inc.
Datasheet

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0
© 2007 Microchip Technology Inc.
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A3
NOTE 1
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Length
Overall Width
Exposed Pad Length
Exposed Pad Width
Contact Width
Contact Length
Contact-to-Exposed Pad
N
1
TOP VIEW
2
D
A1
Dimension Limits
A
E
NOTE 2
EXPOSED PAD
Units
D2
A1
A3
E2
N
A
D
E
K
e
b
L
L
K
0.80
0.00
MIN
1.30
1.50
0.18
0.30
0.20
MILLIMETERS
b
BOTTOM VIEW
0.50 BSC
0.20 REF
2.00 BSC
3.00 BSC
NOM
PIC10F220/222
0.90
0.02
0.25
0.40
8
Microchip Technology Drawing C04-123B
D2
2
e
1
N
MAX
1.00
0.05
0.50
1.75
1.90
0.30
E2
NOTE 1
DS41270E-page 77

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