MPC8260 Freescale Semiconductor, Inc, MPC8260 Datasheet - Page 34
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MPC8260
Manufacturer Part Number
MPC8260
Description
Mpc8260 Powerquicc Ii Integrated Communications Processor
Manufacturer
Freescale Semiconductor, Inc
Datasheet
1.MPC8260.pdf
(52 pages)
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Pinout
Figure 14
Table 20
Table
34
BR
BG
ABB/IRQ2
TS
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
20.
MPC8260A PowerQUICC™ II Integrated Communications Processor Hardware Specifications, Rev. 1.1
shows the pinout list of the MPC826xA.
shows the side profile of the TBGA package to indicate the direction of the top surface view.
Soldermask
1.27 mm Pitch
Polymide Tape
(Oxidized for Insulation)
Copper Heat Spreader
Pin Name
Figure 14. Side View of the TBGA Package
Glob-Top Dam
Table 20. Pinout List
Glob-Top Filled Area
Table 21
View
Die
Wire Bonds
defines conventions and acronyms used in
Attach
Die
W5
F4
E2
E3
G1
H5
H2
H1
J5
J4
J3
J2
J1
K4
K3
K2
K1
L5
L4
L3
L2
L1
Copper Traces
Cavity
Etched
Pressure Sensitive
Ball
Adhesive
Freescale Semiconductor