HSM2694 Renesas Electronics Corporation., HSM2694 Datasheet

no-image

HSM2694

Manufacturer Part Number
HSM2694
Description
Silicon Epitaxial Planar Diode For Tuner Band Switch
Manufacturer
Renesas Electronics Corporation.
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSM2694
Manufacturer:
HITACHI
Quantity:
2 500
Part Number:
HSM2694
Manufacturer:
VISHAY/威世
Quantity:
20 000
HSM2694
Silicon Epitaxial Planar Diode for Tuner Band Switch
Features
Ordering Information
Type No.
HSM2694
Pin Arrangement
Rev.2.00, Oct.08.2003, page 1 of 4
Low forward resistance. (r
Low capacitance. (C = 1.2 pF max)
MPAK package is suitable for high density surface mounting and high speed assembly.
f
= 0.9
Laser Mark
B3
max)
(Top View)
2
3
1
1. Cathode
2. Cathode
3. Anode
Package Code
MPAK
(Previous: ADE-208-095A)
REJ03G0110-0200Z
Oct.08.2003
Rev.2.00

Related parts for HSM2694

HSM2694 Summary of contents

Page 1

... Silicon Epitaxial Planar Diode for Tuner Band Switch Features Low forward resistance 0.9 f Low capacitance 1.2 pF max) MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSM2694 Pin Arrangement Rev.2.00, Oct.08.2003, page max) Laser Mark Cathode ...

Page 2

HVM2694 Absolute Maximum Ratings (Ta = 25°C) Item Symbol Reverse voltage Power dissipation Pd * Junction temperature Tj Storage temperature Tstg Operation temperature Topr Note: 1. Two device total 1 Electrical Characteristics * (Ta = 25°C) Item ...

Page 3

HVM2694 Main Characteristic 2 100MHz 1.5 1.0 0.5 0 –4 – Forward current I F Fig.1 Forward resistance vs. Forward current 10 1.0 0.1 1.0 10 Frequency f (MHz) Fig.3 Forward resistance vs. Frequency Rev.2.00, Oct.08.2003, ...

Page 4

HVM2694 Package Dimensions + 0.10 3–0.4 – 0.05 (0.95) (0.95) 1.9 ± 0.2 + 0.3 2.8 – 0.1 Rev.2.00, Oct.08.2003, page January, 2003 Unit 0.10 0.16 – 0.06 0 – 0.1 Package Code ...

Page 5

Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble ...

Related keywords