MC74VHCT50AMG ON Semiconductor, MC74VHCT50AMG Datasheet - Page 5

IC BUFF/LVL SHFTR N-INV 14SOEIAJ

MC74VHCT50AMG

Manufacturer Part Number
MC74VHCT50AMG
Description
IC BUFF/LVL SHFTR N-INV 14SOEIAJ
Manufacturer
ON Semiconductor
Series
74VHCTr
Datasheet

Specifications of MC74VHCT50AMG

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
6
Number Of Bits Per Element
1
Current - Output High, Low
8mA, 8mA
Voltage - Supply
2 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
14-SOIC (5.3mm Width), 14-SOP, 14-SOIJ
Logic Family
VHCT
Number Of Channels Per Chip
5
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
High Level Output Current
- 8 mA
Low Level Output Current
8 mA
Maximum Power Dissipation
500 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
6 / 3
Propagation Delay Time
11.4 ns at 3.3 V, 8.5 ns at 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
8
7
0.58
M
14X
−B−
T
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT
PACKAGE DIMENSIONS
S
PLASTIC SOIC PACKAGE
0.25 (0.010)
1
MC74VHCT50A
http://onsemi.com
R
CASE 751A−03
X 45
D SUFFIX
ISSUE G
7.04
_
M
7X
M
B
5
M
DIMENSIONS: MILLIMETERS
1.52
J
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
DIM
A
B
C
D
G
K
M
R
F
J
P
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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