IC-LVBLCCLV4C iC-Haus, IC-LVBLCCLV4C Datasheet - Page 3

• Manufacturer Part Number: IC-LVBLCCLV4C
• Description: Opto Encoder Package Specification
• Manufacturer: iC-Haus

iC-LV BLCC LV4C
OPTO ENCODER PACKAGE SPECIFICATION
DIMENSION TABLE
Item
Notes:
G1
A1
A2
A3
A4
A5
A6
A7
A8
A9
C1
H1
H2
H3
T1
J1
J2
J3
J4
L1
L2
L3
L4
1
) nominal glass thickness of 0.4 mm
Parameter
Substrate
Outline X
Outline Y
Alignment Hole Diameter
Cut-Out Radius
Cut-Out Centers
Hole to Hole Pitch
Outline vs. Reference Y
Reference vs. Center Y
Substrate Thickness
Encapsulation
Mold Thickness
Chip Placement
Chip Thickness
Chip Position vs. Reference Y
Chip Symmetry
Chip Parallelism
Bottom Metal Pattern
Lead Size
Lead Pitch
(or Lead-Lead Distance)
Lead-Lead Spacing
Lead Size
Glass Cover
Glass Size X
Glass Size Y
Glass Position vs. Reference Y
Glass Thickness
Thickness Specifications
Overall Thickness
Comments
alignment hole center is reference
tolerance applies also to Y-direction
bottom package to bottom die
note
center of photodiode
not accumulative
note
1
1
)
) bottom substrate to top of glass
Min.
0.75
0.50
1.38
Typ.
0.80
0.30
5.44
0.15
0.65
0.95
3.40
5.55
0.40
7.0
7.0
0.8
1.0
1.0
4.0
6.2
2.7
0.8
0.8
Max.
1.00
0.70
1.80
0.4
0.1
Rev A5, Page 3/4
Tolerance
+0.05
±0.08
±0.15
±0.15
±0.15
±0.15
±0.08
±0.05
±0.05
±0.05
±0.05
±0.2
±0.1
Unit
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm
mm