LOW TDK Corp., LOW Datasheet - Page 33

• Manufacturer Part Number: LOW
• Description: Lan Components Tla Series Conformity To Rohs Directive
• Manufacturer: TDK Corp.

PACKAGING STYLES
Tray : 45pieces/tray
RECOMMENDED SOLDERING CONDITION
FLOW SOLDERING
Preheating: 90 to 130°C for 30 to 45 seconds.
Soldering: 255°C max. 5±1 seconds
• Perform flow soldering from the underside of the board.
• The surface of plastic protrusions inserted into the board may
• The cutted end of terminal has no plating(out of subject of solder
RECOMMENDED CONDITION FOR LONG TERM STORE
When it stores for a long term, please avoid place of high tempera-
ture and high humidity. Recommend that it uses after the delivery
within 1year.
Temperature range: +5 to +30°C
Humidity: 60(%)RH max.
• All specifications are subject to change without notice.
255˚C max.
130˚C
90˚C
melt, but this causes no problems with regard to electrical
properties or mounting.
ability).
Preheating: 30 to 45s
Time ( s )
5±1s
Natural
cooling
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