TD62703FG TOSHIBA Semiconductor CORPORATION, TD62703FG Datasheet

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TD62703FG

Manufacturer Part Number
TD62703FG
Description
6ch High Voltage Source Driver
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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TD62703FG
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TD62703FG
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6CH HIGH VOLTAGE SOURCE DRIVER
The TD62703PG, TD62703FG is comprised of six source current
Transistor Array.
These drivers are specifically designed for fluorescent display
applications.
For proper operation, the substrate (SUB) must be connected to
the most negative voltage.
The suffix (G) appended to the part number represents a Lead
(Pb)-Free product.
Features
Pin Connection
Schematics
High output voltage
Output current (single output) : I
Input resistor
Package type−PG : DIP−14 pin
Package type−FG : SOP−14 pin
Note:
The input and output parasitic diodes cannot be used as clamp diodes.
TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC
(each driver)
TD62703PG,TD62703FG
(top view)
: V
: R
OUT
CC
IN
, V
= 2.7 kΩ
= −50 mA (max)
OUT
= 60 V (min)
1
Weight
DIP14−P−300−2.54 : 1.11 g (typ.)
SOP14−P−225−1.27: 0.16 g (typ.)
TD62703PG
TD62703FG
TD62703PG/FG
2006-06-14

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TD62703FG Summary of contents

Page 1

... TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TD62703PG,TD62703FG 6CH HIGH VOLTAGE SOURCE DRIVER The TD62703PG, TD62703FG is comprised of six source current Transistor Array. These drivers are specifically designed for fluorescent display applications. For proper operation, the substrate (SUB) must be connected to the most negative voltage. ...

Page 2

Absolute Maximum Ratings CHARACTERISTIC Supply Voltage Output Sustaining Voltage Input Voltage Output Current Input Current PG Power Dissipation FG Operating Temperature Storage Temperature Note 1: On Glass Epoxy PCB (50 × 50 ×1 50%) Note 2: Delated above ...

Page 3

Test Circuit 1. I CEX (ON) IN (OFF OFF Note 1: Pulse width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, t ≤ Note 2: ...

Page 4

Type-PG Free Air Type-FG On Glass Epoxy ② PCB 50×50×1.6mm Cu 30% Type-FG Free Air ③ 4 TD62703PG/FG 2006-06-14 ...

Page 5

Package Dimensions DIP14−P−300−2.54 Weight: 1.11 g (Typ.) TD62703PG/FG 5 Unit: mm 2006-06-14 ...

Page 6

Package Dimensions SOP14−P−225−1.27 Weight: 0.16 g (Typ.) TD62703PG/FG 6 Unit: mm 2006-06-14 ...

Page 7

Notes on Contents 1. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 2. Test Circuits Components in the test circuits are used only to obtain and confirm the ...

Page 8

Points to Remember on Handling of ICs (1) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the ...

Page 9

About solderability, following conditions were confirmed • Solderability (1) Use of Sn-37Pb solder Bath · solder bath temperature = 230°C · dipping time = 5 seconds · the number of times = once · use of R-type flux (2) Use ...

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