HVL375CM Renesas Electronics Corporation., HVL375CM Datasheet

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... Narrow terminal Capacitance deviation. Low series resistance 1.1 max) s Good C-V linearity. Thin Extremely small Flat Lead Package (TEFP) is suitable for surface mount design. Ordering Information Type No. Laser Mark HVL375CM Pin Arrangement Rev.2.00 Mar 10, 2006 page Package Name H TEFP Cathode mark Mark ...

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... HVL375CM Absolute Maximum Ratings Item Reverse voltage V R Junction temperature Tj Storage temperature Tstg Electrical Characteristics Item Symbol Min Reverse current I — — R2 Capacitance 3.3 4 Capacitance ratio n 4.0 Series resistance r — S Note For TEFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...

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... HVL375CM Main Characteristic –10 10 –11 10 –12 10 –13 10 – Reverse voltage V Fig.1 Reverse current vs. Reverse voltage 1.2 1.0 0.8 0.6 0.4 0.2 0 0.1 1.0 Reverse voltage V Fig.3 Series resistance vs. Reverse voltage Rev.2.00 Mar 10, 2006 page 0.1 (V) Reverse voltage V R Fig.2 Capacitance vs. Reverse voltage f = 470MHz ...

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... HVL375CM Package Dimensions Package Name JEITA Package Code RENESAS Code TEFP PUSF0002ZA Rev.2.00 Mar 10, 2006 page Previous Code MASS[Typ.] TEFP / TEFPV 0.0006g Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max 0.40 b 0.25 0.30 0.35 c 0.08 0.13 0.18 0.55 0.60 0. ...

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Sales Strategic Planning Div. Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble ...