HVL144A Renesas Electronics Corporation., HVL144A Datasheet
HVL144A
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HVL144A Summary of contents
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... Adopting the trench structure improves low capacitance 0.43 pF max) • Low forward resistance. (rf = 1.8 Ω max) • Low operation current. • Extremely small Flat Lead Package (EFP) is suitable for surface mount design. Ordering Information Type No. HVL144A Pin Arrangement Rev.3.00 Jul 14, 2006 page Laser Mark Package Name EFP ...
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... HVL144A Absolute Maximum Ratings Item Reverse voltage Forward current Power dissipation Junction temperature Storage temperature Electrical Characteristics Item Symbol Reverse current I R Forward voltage V F Capacitance C Forward resistance ESD-Capability * — > 100 Notes: 1. Failure criterion ; For EFP package, the material of lead is exposed for cutting plane. There for, soldering nature of lead tip part is considered as unquestioned ...
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... HVL144A Main Characteristic - 75° - 0.2 0.4 Forward voltage V Fig.1 Forward current vs. Forward voltage 10 1.0 0.1 0.1 1.0 Reverse voltage V Fig.3 Capacitance vs. Reverse voltage Rev.3.00 Jul 14, 2006 page - 25°C -11 10 -12 10 -13 10 -14 10 0.6 0.8 1.0 (V) F Fig.2 Reverse current vs. Reverse voltage ...
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... HVL144A Fig.5 Forward resistance (parallel) vs. Forward voltage Rev.3.00 Jul 14, 2006 page f=100MHz 0.2 0.4 0.6 Forward voltage V (V) F 0.8 ...
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... HVL144A Package Dimensions Package Name JEITA Package Code RENESAS Code ⎯ EFP PXSF0002ZA Rev.3.00 Jul 14, 2006 page Previous Code MASS[Typ.] EFP / EFPV 0.0007g φ Pattern of terminal position areas Dimension in Millimeters Reference Symbol Min Nom Max A 0.44 0.47 0.50 b 0.25 0.30 0.35 c ...
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Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead ...