FM620 FORMOSA MICROSEMI CO. LTD, FM620 Datasheet - Page 6
![no-image](/images/no-image-200.jpg)
FM620
Manufacturer Part Number
FM620
Description
Chip Schottky Barrier Rectifier
Manufacturer
FORMOSA MICROSEMI CO. LTD
Datasheet
1.FM620.pdf
(7 pages)
PACKAGE
Reel packing
SMC
Suggested thermal profiles for soldering processes
Chip Schottky Barrier Rectifier
FM620 THRU FM6100
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
3.Flow (wave)soldering (solder dipping)
1.Storage environment: Temperature=10 C~35 C Humidity=65%±15%
2.Reflow soldering of surface-mount devices
REEL SIZE
13"
T
T
25
T
Average ramp-up rate(T
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t
Tsmax to T
-Ramp-upRate
Time maintained above:
-Temperature(T
-Time(t
Peak Temperature(T
Time within 5 C of actual Peak
Temperature(t
Ramp-down Rate
Time 25 C to Peak Temperature
P
L
S
T
smin
T
REEL
(pcs)
3000
smax
L
o
)
Profile Feature
L
o
COMPONENT
P
)
SPACING
L
(m/m)
)
8.0
Preheat
s
t25
)
P
t
)
s
o
C
L
to Peak
to T
(pcs)
6000
BOX
Ramp-up
Time
P
)
o
337*337*37
Page 6
INNER
(m/m)
BOX
o
Ramp-down
t
P
(m/m)
REEL
DIA,
330
Soldering Condition
t
L
255 C-0/+5 C
60~150sec
<3 C/sec
60~120sec
<6 C/sec
10~30sec
<6minutes
360*340*370
<3 C/sec
CARTON
o
o
100 C
150 C
183 C
o
(m/m)
SIZE
o
o
o
o
Critical Zone
Document ID
DS-121670
Wave Soldering
IR Reflow
o
T
L
to
Formosa MS
CARTON
T
Issued Date
2008/02/10
48,000
(pcs)
P
Revised Date
-
GROSS WEIGHT
APPROX.
Revision
(kg)
17.2
A
Page.
7