CD4024BMS Intersil Corporation, CD4024BMS Datasheet - Page 9

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CD4024BMS

Manufacturer Part Number
CD4024BMS
Description
Rad-hard Cmos Ripple-carry Binary Counter/dividers
Manufacturer
Intersil Corporation
Datasheet
Typical Performance Characteristics
FIGURE 10. TYPICAL DYNAMIC POWER DISSIPATION AS A
Chip Dimensions and Pad Layouts
SIONS AND PAD LAYOUT FOR CD4040BMS ARE IDENTICAL
DIMENSIONS AND PAD LAYOUT FOR CD4020BMS. DIMEN-
10
10
10
10
10
5
4
3
2
8
6
4
2
8
6
4
2
8
6
4
2
8
6
4
2
1
AMBIENT TEMPERATURE (T
SUPPLY VOLTAGE (VDD) = 5V
2
FUNCTION OF INPUT PULSE FREQUENCY FOR
CD4020BMS
4
6
8
10
INPUT PULSE FREQUENCY (f ) (kHz)
2
4
6
8
10
2
2
A
METALLIZATION: Thickness: 11k
PASSIVATION: 10.4kÅ - 15.6k
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
4
CD4020BMS, CD4024BMS, CD4040BMS
) = +25
6
8
10
5V
3
o
10V
C
2
CD = 15pF
CL = 50pF
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10
10V
4
6
8
10
4
2
4
(Continued)
6
8
10
5
7-367
Å
*
ON FIRST STAGE ONLY
, Silane
FIGURE 11. DETAIL OF TYPICAL FLIP-FLOP STAGES
DIMENSIONS AND PAD LAYOUT FOR CD4024BMSH
Å
p
n
14k
-3
Å, AL.
inch)
p
n
R
p
n
R
R
p
n
*
Q
Q
Q
1

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