CM1450-06CS California Micro Devices, CM1450-06CS Datasheet
CM1450-06CS
Available stocks
Related parts for CM1450-06CS
CM1450-06CS Summary of contents
Page 1
... Better than 40dB of attenuation at 1GHz • Chip Scale Package features extremely low lead inductance for optimum filter and ESD performance • 15-bump, 2.960mm x 1.330mm footprint Chip Scale Package (CM1450-06CS/CP) • 20-bump, 4.000mm x 1.458mm footprint Chip Scale Package (CM1450-08CS/CP) • Lead-free version available Applications • ...
Page 2
... TOP VIEW (Bumps Down View) Orientation Marking (see note 2) A N506 B C CM1450-06CS/CP 15-Bump CSP Package Orientation Marking (see note 2) A N508 B C CM1450 -08CS/CP 20-Bump CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. ...
Page 3
... AC At 2.5V DC, 1MHz, 30mV AC =50Ω =50Ω I =10µA DIODE V =+3.3V DIODE I = 10mA LOAD Notes 2,4 and 5 Notes 2,3,4 and 5 ● Tel: 408.263.3214 PRELIMINARY CM1450 RATING -65 to +150 100 500 RATING -40 to +85 (NOTE 1) MIN TYP MAX 137 300 5.5 100 5 ...
Page 4
... Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B1) Figure 2. Filter Capacitance vs. Input Voltage over Temperature (normalized to capacitance at 2.5VDC and 25°C) © 2005 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ● ● Tel: 408.263.3214 Fax: 408.263.7846 PRELIMINARY CM1450 ● www.calmicro.com 01/27/05 ...
Page 5
... Solder Mask Opening 0.325mm DIA. 250 200 150 100 50 0 Figure 5. Lead-free (SnAgCu) Solder ● ● Tel: 408.263.3214 PRELIMINARY CM1450 VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125mm - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50µm +20µm 60 seconds 260° ...
Page 6
... Mechanical Details CM1450 devices are supplied in custom Chip Scale Packages (CSP). Dimensions for each of these devices are presented in the following pages. CM1450-06CS/CP Mechanical Specifications The package dimensions for the CM1450-06CS/CP are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps Millimeters Dim ...
Page 7
... Mechanical Details (cont’d) CM1450-08CS/CP Mechanical Specifications The package dimensions for the CM1450-08CS/CP are presented below. PACKAGE DIMENSIONS Package Custom CSP Bumps Millimeters Dim Min Nom Max Min A1 3.955 4.000 4.045 0.1557 0.1575 0.1593 A2 1.413 1.458 1.503 0.0556 0.0574 0.0592 B1 0.495 0.500 0.505 0.0195 0.0197 0.0199 B2 0 ...
Page 8
... X 1.57 X 0.76 8mm Embossment P 1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data ● ● Tel: 408.263.3214 PRELIMINARY CM1450 REEL QTY PER P DIAMETER REEL 178mm (7") 3500 4mm 178mm (7") 3500 4mm 10 Pitches Cumulative Tolerance On Tape ± 0 Center Lines of Cavity ● ...