NLU1GT125CMX1TCG ON Semiconductor, NLU1GT125CMX1TCG Datasheet - Page 7

• Manufacturer Part Number: NLU1GT125CMX1TCG
• Description: IC BUFF TRI-ST TTL N-INV 6ULLGA
• Manufacturer: ON Semiconductor

Specifications of NLU1GT125CMX1TCG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-ULLGA
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Screw
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: 3-State
• Propagation Delay Time: 11.5 ns at 3 V to 3.6 V, 7.5 ns at 4.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6X
REFERENCE
PIN ONE
0.10 C
0.05 C
0.05 C
0.10 C
L1
É É
É É É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
4
A1
3
e
6X
E
A
B
A
b
5X
0.10
0.05
C
L
SEATING
PLANE
NOTE 4
C
C
PACKAGE DIMENSIONS
A
NOTE 3
ULLGA6 1.2x1.0, 0.4P
B
http://onsemi.com
CASE 613AE-01
NLU1GT125
ISSUE A
7
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
MOUNTING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
PKG
DIM
0.49
A1
L1
A
D
E
b
e
L
5X
1
MILLIMETERS
MIN
0.00
0.15
0.25
0.35
---
1.20 BSC
1.00 BSC
0.40 BSC
DIMENSIONS: MILLIMETERS
MAX
0.40
0.05
0.25
0.35
0.45
PITCH
1.24
0.40
0.26
6X