74LX1G07CTR STMicroelectronics, 74LX1G07CTR Datasheet
74LX1G07CTR
Specifications of 74LX1G07CTR
74LX1G07CTR
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74LX1G07CTR Summary of contents
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... C101) Applications ■ Mobile phones Table 1. Device summary Order code 74LX1G07STR 74LX1G07CTR 74LX1G07BJR April 2008 Single buffer/driver with open drain = 3 °C Description The 74LX1G07 is a low voltage CMOS single buffer/driver (open drain) fabricated with sub- ...
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Contents Contents 1 Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...
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Pin connection Figure 1. Pin connection and IEC symbols SOT package Top view Table 2. Pin assignments Pin number Flip-chip 4 − Table 3. Truth table Z: ...
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Pin connection Figure 2. Input and output equivalent circuit Input ESD protection GND 4/ GND GND 74LX1G07 Overvoltage control Output ESD protection GND GND CS08973 ...
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... These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 4. ...
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Maximum rating 2.1 Recommended operating conditions Table 5. Recommended operating conditions Symbol V Supply voltage CC V Input voltage I V Output voltage ( Output voltage (high or low state High or low level output current ...
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Electrical characteristics Table 6. DC specifications Symbol Parameter High level input V IH voltage Low level input V IL voltage Low level output V OL voltage High impedance I output leakage OZ current Input leakage I I current ...
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Electrical characteristics Table 7. AC electrical characteristics Symbol Propagation delay t PLZ time Propagation delay t PZL time Table 8. Capacitive characteristics Symbol C Input capacitance IN C Output capacitance OUT Power dissipation C PD capacitance defined ...
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Figure 3. Test circuit Pulse generator Table 9. Test circuit and waveform symbol value Symbol Figure 4. Waveform: propagation delay ( MHz; 50% duty cycle) ...
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Package mechanical data 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and ...
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Figure 6. SOT323-5L package outline Table 11. SOT323-5L mechanical data Symbol millimeters Typ Min Max 0.80 1.10 0.00 0.10 0.80 1.00 0.15 0.30 0.10 0.18 1.80 2.20 1.80 ...
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Package mechanical data Figure 7. Flip-chip 4 package outline 12/20 74LX1G07 ...
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Table 12. Flip-chip 4 mechanical data Symbol ccc millimeters Min Typ 0.535 0.58 0.18 0.205 0.355 0.375 0.215 0.255 0.84 0.87 0.5 0.84 0.87 0.5 0.25 0.25 0.175 ...
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Package mechanical data Figure 8. Flip-chip 4 recommended footprint 14/20 74LX1G07 ...
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Figure 9. SOT23-xL tape and reel Table 13. SOT23-xL tape and reel mechanical data Symbol millimeters Typ Min Max 180 12.8 13.0 13.2 20.2 60 14.4 3.13 3.23 3.33 ...
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Package mechanical data Figure 10. SOT323-xL tape and reel 1. Drawing not to scale. Table 14. SOT323-xL tape and reel mechanical data Symbol 16/20 millimeters Typ Min Max 175 180 ...
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Figure 11. Flip-chip 4 reel information - back side Figure 12. Flip-chip 4 reel information - front side Package mechanical data 17/20 ...
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Package mechanical data Figure 13. Flip-chip 4 carrier tape information Figure 14. Flip-chip 4 tape orientation - Top view of package - Balls underneath - Pin A1 marked from target spec 18/20 Tape and reel A1 direction of flow 74LX1G07 ...
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Revision history Table 15. Document revision history Date 04-Sept-2004 03-May-2006 17-Jan-2008 29-Jan-2008 21-Feb-2008 23-Apr-2008 Revision 4 Document change. 5 Data reel updating. Document restructured and converted to new ST template. 6 Added 74LX1G07BJR and related package information. Flip-Chip ...
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... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...