MC74HCT244ANG ON Semiconductor, MC74HCT244ANG Datasheet - Page 7
![IC BUFF/DVR/RCVR 3ST DUAL 20DIP](/photos/7/4/70408/20-dip_738_sml.jpg)
MC74HCT244ANG
Manufacturer Part Number
MC74HCT244ANG
Description
IC BUFF/DVR/RCVR 3ST DUAL 20DIP
Manufacturer
ON Semiconductor
Series
74HCTr
Specifications of MC74HCT244ANG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
2
Number Of Bits Per Element
4
Current - Output High, Low
6mA, 6mA
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
20-DIP (0.300", 7.62mm)
Circuit Type
Low-Power Schottky
Current, Supply
160 μA
Function Type
8-Channels
Logic Function
Buffer/Driver/Receiver
Number Of Circuits
Octal
Package Type
PDIP-20
Special Features
Non-Inverting, Tri-State
Temperature, Operating, Range
-55 to +125 °C
Voltage, Supply
4.5 to 5.5 V
Logic Family
HCT
Number Of Channels Per Chip
8
Polarity
Non-Inverting
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
High Level Output Current
- 6 mA
Low Level Output Current
6 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
8 / 3
Output Type
3-State
Propagation Delay Time
20 ns at 5 V
Logical Function
Buffer/Line Driver
Number Of Elements
2
Number Of Channels
8
Number Of Inputs
8
Number Of Outputs
8
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
Quiescent Current
4uA
Technology
CMOS
Pin Count
20
Mounting
Through Hole
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
4.5V To 5.5V
Logic Case Style
DIP
No. Of Pins
20
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Breakdown Voltage
24V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HCT244ANGOS
0.15 (0.006) T
0.15 (0.006) T
L
2X
−T−
U
PIN 1
IDENT
U
L/2
C
0.100 (0.004)
S
S
SEATING
PLANE
20
1
D
0.36
16X
20X
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−V−
0.10 (0.004)
A
K
REF
G
H
M
10
11
PACKAGE DIMENSIONS
T
SOLDERING FOOTPRINT*
1
1.26
16X
U
http://onsemi.com
−U−
MC74HCT244A
S
B
CASE 948E−02
DT SUFFIX
V
TSSOP−20
ISSUE C
S
7.06
N
7
J J1
N
DETAIL E
Í Í Í Í
Í Í Í Í
Í Í Í Í
DETAIL E
SECTION N−N
F
0.25 (0.010)
DIMENSIONS: MILLIMETERS
K1
K
M
−W−
NOTES:
0.65
PITCH
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION:
3. DIMENSION A DOES NOT INCLUDE
4. DIMENSION B DOES NOT INCLUDE
5. DIMENSION K DOES NOT INCLUDE
6. TERMINAL NUMBERS ARE SHOWN FOR
7. DIMENSION A AND B ARE TO BE
ANSI Y14.5M, 1982.
MILLIMETER.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
REFERENCE ONLY.
DETERMINED AT DATUM PLANE −W−.
DIM
J1
K1
M
A
B
C
D
F
G
H
K
L
J
MILLIMETERS
MIN
6.40
4.30
0.05
0.50
0.27
0.09
0.09
0.19
0.19
−−−
0
0.65 BSC
6.40 BSC
_
MAX
6.60
4.50
1.20
0.15
0.75
0.37
0.20
0.16
0.30
0.25
8
_
0.252
0.169
0.002
0.020
0.004
0.004
0.007
0.007
0.011
MIN
−−−
0
0.026 BSC
0.252 BSC
_
INCHES
0.260
0.177
0.047
0.006
0.030
0.015
0.008
0.006
0.012
0.010
MAX
8
_