MC74HC126ANG ON Semiconductor, MC74HC126ANG Datasheet - Page 7
![IC BUFFER TRI-ST QD N-INV 14DIP](/photos/6/58/65803/14-dip_646-06_sml.jpg)
MC74HC126ANG
Manufacturer Part Number
MC74HC126ANG
Description
IC BUFFER TRI-ST QD N-INV 14DIP
Manufacturer
ON Semiconductor
Series
74HCr
Datasheet
1.MC74HC125ANG.pdf
(9 pages)
Specifications of MC74HC126ANG
Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
4
Number Of Bits Per Element
1
Current - Output High, Low
7.8mA, 7.8mA
Voltage - Supply
2 V ~ 6 V
Operating Temperature
-55°C ~ 125°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Logic Family
HC
Number Of Channels Per Chip
4
Polarity
Non-Inverting
Supply Voltage (max)
6 V
Supply Voltage (min)
2 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
High Level Output Current
- 7.8 mA
Low Level Output Current
7.8 mA
Maximum Power Dissipation
750 mW
Minimum Operating Temperature
- 55 C
Number Of Lines (input / Output)
4 / 3
Output Type
3-State
Propagation Delay Time
90 ns at 2 V, 36 ns at 3 V, 18 ns at 4.5 V, 15 ns at 6 V
Logical Function
Buffer/Line Driver
Number Of Elements
4
Number Of Channels
4
Number Of Inputs
4
Number Of Outputs
4
Operating Supply Voltage (typ)
2.5/3.3/5V
Package Type
PDIP
Operating Supply Voltage (max)
6V
Operating Supply Voltage (min)
2V
Quiescent Current
4uA
Technology
CMOS
Pin Count
14
Mounting
Through Hole
Operating Temp Range
-55C to 125C
Operating Temperature Classification
Military
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
2V To 6V
Logic Case Style
DIP
No. Of Pins
14
Operating Temperature Range
-55°C To +125°C
Filter Terminals
DIP
Rohs Compliant
Yes
Family Type
HC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC74HC126ANGOS
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
0.58
T
14X
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
http://onsemi.com
1
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE H
M
7.04
7X
B
7
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_