MTP2N50E Freescale Semiconductor, Inc, MTP2N50E Datasheet

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MTP2N50E

Manufacturer Part Number
MTP2N50E
Description
Manufacturer
Freescale Semiconductor, Inc
Datasheet

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Part Number:
MTP2N50E
Manufacturer:
MOT/ON
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12 500
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Designer's
TMOS
Power Field Effect Transistor
N–Channel Enhancement–Mode Silicon Gate
scheme to provide enhanced voltage–blocking capability without
degrading performance over time. In addition, this advanced TMOS
E–FET is designed to withstand high energy in the avalanche and
commutation modes. The new energy efficient design also offers a
drain–to–source diode with a fast recovery time. Designed for high
voltage, high speed switching applications in power supplies,
converters and PWM motor controls, these devices are particularly
well suited for bridge circuits where diode speed and commutating
safe operating areas are critical and offer additional safety margin
against unexpected voltage transients.
Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves — representing boundaries on device characteristics — are given to facilitate “worst case” design.
E–FET and Designer’s are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
REV 1
 Motorola, Inc. 1995
MAXIMUM RATINGS
Motorola TMOS Power MOSFET Transistor Device Data
Drain–Source Voltage
Drain–Gate Voltage (R GS = 1.0 M )
Gate–Source Voltage — Continuous
Drain Current — Continuous
Total Power Dissipation
Operating and Storage Temperature Range
Single Pulse Drain–to–Source Avalanche Energy — Starting T J = 25 C
Thermal Resistance — Junction to Case
Maximum Lead Temperature for Soldering Purposes, 1/8 from case for 10 seconds
This high voltage MOSFET uses an advanced termination
Robust High Voltage Termination
Avalanche Energy Specified
Source–to–Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
Diode is Characterized for Use in Bridge Circuits
I DSS and V DS(on) Specified at Elevated Temperature
Derate above 25 C
(V DD = 100 Vdc, V GS = 10 Vdc, I L = 3.5 Apk, L = 10 mH, R G = 25 )
— Continuous @ 100 C
— Single Pulse (t p
E-FET.
— Junction to Ambient
— Non–Repetitive (t p
(T C = 25 C unless otherwise noted)
Data Sheet
10 s)
Rating
10 ms)
G
D
S
Symbol
T J , T stg
V GSM
V DGR
V DSS
R JC
R JA
V GS
E AS
I DM
P D
T L
I D
I D
MTP2N50E
CASE 221A–06, Style 5
TMOS POWER FET
R DS(on) = 3.6 OHM
Motorola Preferred Device
– 55 to 150
2.0 AMPERES
Value
500 VOLTS
1.67
62.5
500
500
260
2.0
1.6
6.0
0.6
TO–220AB
75
61
20
40
Order this document
by MTP2N50E/D
Watts
W/ C
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
C/W
mJ
C
C
1

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MTP2N50E Summary of contents

Page 1

... Preferred devices are Motorola recommended choices for future use and best overall value. REV 1 Motorola TMOS Power MOSFET Transistor Device Data  Motorola, Inc. 1995 ms) Order this document by MTP2N50E/D MTP2N50E Motorola Preferred Device TMOS POWER FET 2.0 AMPERES 500 VOLTS R DS(on) = 3.6 OHM  ...

Page 2

... MTP2N50E ELECTRICAL CHARACTERISTICS ( 25°C unless otherwise noted) Characteristic OFF CHARACTERISTICS Drain–Source Breakdown Voltage ( Vdc 250 Adc) Temperature Coefficient (Positive) Zero Gate Voltage Drain Current ( 500 Vdc Vdc 500 Vdc Vdc 125°C) Gate– ...

Page 3

... Figure 4. On–Resistance versus Drain Current 1000 100 10 1 100 125 150 0 50 100 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 6. Drain–To–Source Leakage MTP2N50E – 55°C 25°C 100°C 3.5 4 4.5 5 5 1.2 1.6 2 2.4 2.8 3.2 3 DRAIN CURRENT (AMPS) and Gate Voltage 125° ...

Page 4

... MTP2N50E Switching behavior is most easily modeled and predicted by recognizing that the power MOSFET is charge controlled. The lengths of various switching intervals ( t) are deter- mined by how fast the FET input capacitance can be charged by current from the generator. The published capacitance data is difficult to use for calculat- ing rise and fall because drain– ...

Page 5

... DM ), the energy rating is specified at rated continuous cur- rent ( accordance with industry custom. The energy rat- ing must be derated for temperature as shown in the accompanying graph (Figure 12). Maximum energy at cur- rents below rated continuous I D can safely be assumed to equal the values indicated. MTP2N50E t d(off d(on ...

Page 6

... MTP2N50E SINGLE PULSE 25°C 100 0.1 R DS(on) LIMIT THERMAL LIMIT PACKAGE LIMIT 0.01 0 DRAIN–TO–SOURCE VOLTAGE (VOLTS) Figure 11. Maximum Rated Forward Biased Safe Operating Area 0.5 0.2 0.1 0.1 0.05 0.02 0.01 SINGLE PULSE 0.01 1.0E–05 1.0E–04 6 SAFE OPERATING AREA ...

Page 7

... PLANE C S STYLE 5: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN R J CASE 221A–06 ISSUE Y MTP2N50E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. INCHES MILLIMETERS DIM MIN MAX ...

Page 8

... JAPAN: Nippon Motorola Ltd.; 4–32–1, Nishi–Gotanda, Shinagawa–ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. ◊ 8 *MTP2N50E/D* Motorola TMOS Power MOSFET Transistor Device Data MTP2N50E/D ...

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