CXA1645 Sony, CXA1645 Datasheet
CXA1645
Available stocks
Related parts for CXA1645
CXA1645 Summary of contents
Page 1
... RGB Encoder For the availability of this product, please contact the sales office. Description The CXA1645P encoder IC that converts analog RGB signals to a composite video signal. This IC has various pulse generators necessary for encoding. Composite video outputs and Y/C outputs for the S terminal are obtained just by inputting composite sync, subcarrier and analog RGB signals ...
Page 2
... ON only in the burst flag period. CLP NO CONNECTION Subcarrier input. Input 0.4 to 0.5Vp-p sine wave or pulse. Refer to Notes on Operation, Nos. 3 and 5. Pin for switching between NTSC and PAL modes NTSC PAL: GND CC BF pulse monitoring output. Incapable of driving a 75Ω load. CXA1645P/M ...
Page 3
... Power supply for all circuits other than RGB, composite video and Y/C output circuits. Refer to Notes on Operation. Nos. 4 and 10. Pin to determine the internal reference current. Connect to GND via a 47kΩ resistor. Internal reference voltage. Connect a decoupling capacitor of approximately 10µF. Refer to Notes on Operation, Nos. 4 and 7. CXA1645P/M ...
Page 4
... GND. Decide capacitance and inductance, giving consideration to cross color and the required resolution. No influence on the YOUT pin. Refer to Notes on Operation, No. 8. Internal filter fo adjustment pin. Connect to GND via the following resistor according to the NTSC or PAL mode. NTSC: 20kΩ (±1%) PAL : 16kΩ (±1%) CXA1645P/M ...
Page 5
... Refer to Notes on Operation, Nos. 6 and 9. Analog RGB signal outputs. Capable of driving a 75Ω load. Refer to Notes on Operation, Nos. 6 and 9. Ground for RGB, composite video and Y/C output circuits. The leads to GND1 should be as short and wide as possible. CXA1645P/M ...
Page 6
... DC direct coupling 2. 1.0Vp-p –3 200kHz/5MHz Pin 9 = Clamp voltage Fig. 3 0.26 0.29 SG1 to SG3: 100% color bar 0.17 0.21 input, 1.0Vp-p (Max.) 0.35 0.42 SG5: CSYNC 0.065 0.08 TTL level Fig. 4 0.6 0.71 SG1 to SG3: DC direct coupling 2. –3.0 1.0Vp 200kHz/5MHz Pin 9 = Clamp voltage Fig. 3 CXA1645P/M Max. Unit mA 0.78 Vp-p dB 0.33 Vp-p 0.26 V 0.49 V 0.095 V 0. ...
Page 7
... SG4: SIN wave, SG4 5V SG5 20k SG5: CSYNC SG1 to SG3: A/C SG4: SG4 5V SG5 20k SG5: 3.58MHz component measured. Fig. 6 SG1 to SG3: SG4: SIN wave, SG4 GND SG5 16k SG5: CSYNC – 7 – CXA1645P/M Min. Typ. Max. 0.2 0.25 0.3 2.84 3.16 3.48 94 104 114 2.65 2.95 3.25 231 ...
Page 8
... CXA1645P/M ...
Page 9
... GIN SG3 BIN C point 0.5Vp-p CVOUT f = 3.58MHz (B) 4.43MHz 2. (BN) 0.8V A point COUT Vo (BN (B) Vo (BN) K (BP (BN) Vo (BN) – 9 – CXA1645P/M 2.0V 64µs 0.8V 4.5µs 10µs 1.0Vp-p 1.0Vp-p 1.0Vp-p Vo (YB (YW) (YG) Vo (YR) Fig. 4 0.5Vp 3.58MHz 2.0V 64µs 0.8V 4.5µs 10µs 1.0Vp-p 1.0Vp-p 1.0Vp-p ...
Page 10
... Modulator PULSE GEN 0.1µ 0.01µ SYNC OUT OUT 220µ 220µ 47k 10µ DRIVER DRIVER REGULATOR BPF R-Y Modulator B-Y Modulator PULSE GEN 0.1µ 0.01µ SYNC IN CXA1645P +5V 0.1µ 47µ +5V 0.1µ 47µ ...
Page 11
... Pin 15 as the C signal. At the same time, Y and C signals are mixed and output from Pin 20 as the composite video signal. Burst Signal The CXA1645P/M generates burst signals at the timing shown below according to the composite sync signal input. H synchronization (TTL level) ...
Page 12
... Notes on Operation Be careful of the following when using the CXA1645P/M. 1. This IC is designed for image processing of personal computers and video games. When using the IC in other video devices, make thorough investigations on image quality sure that analog RGB signals are input at 1.0Vp-p maximum and have low enough impedance. High impedance may affect color saturation, hue, etc ...
Page 13
... This IC employs a number of 75Ω driver pins, so oscillation is likely to occur when measures described in Nos. 4 and 6 are not taken thoroughly. Be very careful of oscillation in printed circuit board design and carry out thorough investigations in the actual driving condition. 68pF 17 Small C Low Large 17 Small C Low L 75 220µF PIN 75 – 13 – CXA1645P Decide the values ...
Page 14
... SOP (PLASTIC) + 0.4 15.0 – 0 0.45 ± 0.1 1.27 ± 0.12 M PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT SOP-24P-L01 LEAD MATERIAL SOP024-P-0300-A PACKAGE WEIGHT – 14 – CXA1645P/M 0° to 15° EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY 2.0g + 0.4 1.85 – 0.15 0.15 + 0.2 0.1 – 0.05 + 0.1 0.2 – 0.05 EPOXY/PHENOL RESIN SOLDER PLATING COPPER ALLOY / 42ALLOY 0.3g ...