NSSW008C-P1 Nichia, NSSW008C-P1 Datasheet - Page 6

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NSSW008C-P1

Manufacturer Part Number
NSSW008C-P1
Description
Manufacturer
Nichia
Datasheet

Specifications of NSSW008C-P1

Size Lxwxh (mm)
2.8x1.2x0.8
Lumi-nous Inten-sity Typ(cd)
1.5
Lumi-nous Flux Typ(lm))
3.9
Forward Voltage Vf(v) Typ
3.20
Forward Voltage Vf(v) Max
3.50
Directivity (degree)
110
If (ma)
20
Mounting Style
Through Hole
SOLDERING
• Recommended Reflow Soldering Condition(Lead-free Solder)
● Recommended Soldering Pad Pattern
* The product is designed to be reflow soldered to a PCB. If you use dip soldering for the products,
* Reflow soldering must not be performed more than twice. Manual soldering must only be done once.
* Care should be taken to avoid cooling at a rapid rate and ensure the peak temperature ramps down slowly.
* Customer is advised to use nitrogen reflow soldering as air flow process can cause optical degradation
* Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,
* When soldering, avoid applying any stress to the LED package while heated.
Nichia cannot guarantee its reliability.
due to the heat and atmosphere of reflow soldering.
a double-head soldering iron should be used.
It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.
1 to 5°C per sec
Pre-heat
180 to 200°C
120sec Max
1.4
60sec Max
Above 220°C
1
260°C Max
10sec Max
1.4
• Recommended Manual Soldering Condition
Temperature
Soldering Time
(単位 Unit: mm)
350°C Max
3sec Max
5

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