NHSB046-NA Nichia, NHSB046-NA Datasheet - Page 16

• Manufacturer Part Number: NHSB046-NA
• Manufacturer: Nichia

Specifications of NHSB046-NA

• Size Lxwxh (mm): 2.2x1.4x1.3
• Lumi-nous Inten-sity Typ(cd): 85
• Forward Voltage Vf(v) Typ: 2.90
• Forward Voltage Vf(v) Max: 3.10
• Directivity (degree): 115
• If (ma): 5
• Mounting Style: Through Hole

(4) Design Consideration
(5) Electrostatic Discharge (ESD)
(6) Thermal Management
(7) Cleaning
(8) Eye Safety
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not with hands.
● The products are sensitive to static electricity or surge voltage. An ESD event may damage its die
● Proper grounding techniques are required for all devices, equipment and machinery used in the assembly of the products.
● If tools or equipment contain insulating materials, such as glass or plastic, proper measures against electro static discharge,
● When performing the characteristics inspection of the LEDs in your application, customer is advised to check on the LEDs
● ESD-damaged LEDs may have a current flow at low voltage, or no longer light up at low current.
● Thermal management is an important factor when designing your product by using the LEDs.
● Drive current should be determined for the surrounding ambient temperature (T
● If required, isopropyl alcohol (IPA) should be used. Other solvents may cause premature failure to the LEDs
● Ultrasonic cleaning is not recommended for the LEDs since it may adversely effect on the LEDs
● The International Electrical Commission (IEC) published in 2006, IEC 62471:2006 Photobiological safety of lamps
● Viewing a flashing light may cause eye discomfort. When incorporating the LED into your product,
The LEDs should be placed so as to minimize the stress on the LEDs due to PCB bow and twist.
The LEDs should be placed so as to minimize the stress on the LEDs due to board flexing.
or reduce its reliability performance. When handling the products, measures against electro static discharge,
including the followings, are strongly recommended.
Also note that surge protection should be considered in the design of customer products.
including the followings, are strongly recommended.
whether or not they are damaged by ESD. Such damage can be detected during forward voltage measurement or light up test
at low current. (the recommended current is 1mA or lower)
The rise in LED die temperature can be affected by PCB thermal resistance or/and LED spacing as mounted on the board.
Customer is advised to design the product to ensure that the LED die temperature
does not exceed the required maximum Junction Temperature (T
due to the damage to the resin portion. The effects of such solvents should be verified prior to use.
In addition, the use of CFCs such as Freon is heavily regulated.
by the ultrasonic power and LED assembled condition.
If it is unavoidable, customer is advised to check prior to use that the cleaning will not damage the LEDs.
and lamp systems which includes LEDs within its scope. Meanwhile LEDs were removed from the scope
of the IEC 60825-1:2007 laser safety standard, the 2001 edition of which included LED sources within its scope.
However, keep it mind that some countries and regions have adopted standards based on the IEC laser safety standard
IEC 60825-1:2001 which includes LEDs within its scope. Following IEC 62471:2006, most of Nichia LEDs can be classified
as belonging to either Exempt Group or Risk Group 1. Especially a high-power LED, that emits light containing blue wavelengths,
may be in Risk Group 2. Great care should be taken when viewing directly the LED driven at high current or the LED
with optical instruments, which greatly increase the hazard to your eyes.
precaution should be taken to avoid adverse effect on human body caused by the light stimulus.
Dissipating the charge with conductive materials
Preventing the charge generation with moisture
Neutralizing the charge with ionizers
Eliminating the charge;
Wrist strap, ESD footwear and garments, ESD floors
Grounding the equipment and tools at workstation
ESD table/shelf mat (conductive materials)
Failure Criteria: V
F
<2.0V at I
F
=0.5mA
J
).
A
) to dissipate the heat from the product.
15