NS2W757A Nichia, NS2W757A Datasheet - Page 16

• Manufacturer Part Number: NS2W757A
• Manufacturer: Nichia

Specifications of NS2W757A

• Size Lxwxh (mm): 3.0\u00d73.0\u00d70.52
• Lumi-nous Inten-sity Typ(cd): 9.4
• Lumi-nous Flux Typ(lm)): 28.5
• Forward Voltage Vf(v) Typ: 2.85
• Forward Voltage Vf(v) Max: 3.30
• Directivity (degree): 120
• If (ma): 65
• Mounting Style: Through Hole

(4) Design Consideration
(5) Electrostatic Discharge (ESD)
(6) Thermal Management
● PCB warpage after mounting the products onto a PCB can cause the package to break.
● The position and orientation of the LEDs affect how much mechanical stress is exerted on the LEDs placed near the score lines.
● Board separation must be performed using special jigs, not using hands.
● The products are sensitive to static electricity or surge voltage. ESD can damage a die and its reliability.
● Proper grounding is required for all devices, equipment, and machinery used in product assembly.
● If tools or equipment contain insulating materials such as glass or plastic,
● The customer is advised to check if the LEDs are damaged by ESD
● ESD damaged LEDs may have current flow at a low voltage.
● Proper thermal management is an important when designing products with LEDs. LED die temperature is affected
● Drive current should be determined for the surrounding ambient temperature (T
● The following equations can be used to calculate the junction temperature of the products.
The LED should be placed in a way to minimize the stress on the LEDs due to PCB bow and twist.
The LED should be placed in a way to minimize the stress on the LEDs due to board flexing.
When handling the products, the following measures against electrostatic discharge are strongly recommended:
Surge protection should be considered when designing of commercial products.
the following measures against electrostatic discharge are strongly recommended:
when performing the characteristics inspection of the LEDs in the application.
Damage can be detected with a forward voltage measurement at low current (≤2mA).
by PCB thermal resistance and LED spacing on the board. Please design products in a way that the LED die temperature
does not exceed the maximum Junction Temperature (T
1) T
Eliminating the charge
Grounded wriststrap, ESD footwear, clothes, and floors
Grounded workstation equipment and tools
ESD table/shelf mat made of conductive materials
Dissipating static charge with conductive materials
Preventing charge generation with moisture
Neutralizing the charge with ionizers
Failure Criteria: V
*T
T
T
R
R
W=Input power(I
J
=T
A
S
θJA
θJS
J
=LED junction temperature: °C
=Ambient temperature: °C
=Soldering temperature (cathode side): °C
Ts Point
A
=Thermal resistance from junction to ambient: °C/W
=Thermal resistance from junction to T
+R
θJA
･W
F
<2.0V at I
F
×V
2) T
F
): W
J
=T
F
S
=1.0mA
+R
θJS
･W
S
measuring point: °C/W
J
).
A
) to dissipate the heat from the product.
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