L8E75840/L9-PF Ligitek Group, L8E75840/L9-PF Datasheet - Page 5

• Manufacturer Part Number: L8E75840/L9-PF
• Manufacturer: Ligitek Group

Specifications of L8E75840/L9-PF

• Chip Material: GaAsP/GaP
• Chip Peak: 635
• Lens Color: White Diffused
• Forward Voltage(vf) Min.: 1.7
• Forward Voltage(vf) Max.: -
• Iv(mcd) Typ.: 12
• Viewing Angle 2?½: 124
• Pb: Yes
• Mounting Style: Through Hole

PART NO. L8E75840/L9-PF
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Note: 1.Wave solder should not be made more than one time.
2° C/sec(max)
Solder Bath:260°C Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
Soldering Iron:30W Max
Temp(° C)
2.You can just only select one of the soldering conditions as above.
120°
260°
25°
0°
0
60 Seconds Max
Preheat
max
2°/sec
50
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5°/sec
max
100
Time(sec)
150
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