L8G3330/S227-PF/TRS-8 Ligitek Group, L8G3330/S227-PF/TRS-8 Datasheet - Page 6

• Manufacturer Part Number: L8G3330/S227-PF/TRS-8
• Manufacturer: Ligitek Group

Specifications of L8G3330/S227-PF/TRS-8

• Chip Material: GaP
• Chip Peak: 565
• Lens Color: Green Diffused
• Forward Voltage(vf) Min.: 1.7
• Forward Voltage(vf) Max.: -
• Iv(mcd) Typ.: 28
• Viewing Angle 2?½: 28
• Pb: Yes
• Mounting Style: Through Hole

PART NO.
1.Iron:
Soldering Condition(Pb-Free)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
Ramp-Down:-5° C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Note: 1.Wave solder should not be made more than one time.
2°C/sec(max)
Soldering Iron:30W Max
Temperature 350° C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to body)
Temp(° C)
2.You can just only select one of the soldering conditions as above.
120°
260°
L8G3330/S227-PF/TRS-8
25°
0°
0
60 Seconds Max
Preheat
2°/sec
max
50
LIGITEK ELECTRONICS CO.,LTD.
260°C3sec Max
Property of Ligitek Only
5° /sec
max
100
Time(sec)
150
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