MC74HCT245ANG ON Semiconductor, MC74HCT245ANG Datasheet - Page 5

• Manufacturer Part Number: MC74HCT245ANG
• Description: IC BUS TRANSCVR 3-ST 8BIT 20DIP
• Manufacturer: ON Semiconductor
• Series: 74HCTr

Specifications of MC74HCT245ANG

• Logic Type: Transceiver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 8
• Current - Output High, Low: 6mA, 6mA
• Voltage - Supply: 4.5 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Logic Family: 74HCT
• Number Of Channels Per Chip: 8
• Input Level: TTL
• Output Level: CMOS
• Output Type: 3-State
• High Level Output Current: - 6 mA
• Low Level Output Current: 6 mA
• Propagation Delay Time: 22 ns
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 4.5 V
• Maximum Operating Temperature: + 125 C
• Function: Bus Transceiver
• Input Bias Current (max): 4 uA
• Maximum Power Dissipation: 750 mW
• Minimum Operating Temperature: - 55 C
• Mounting Style: Through Hole
• Number Of Circuits: 8
• Polarity: Non-Inverting
• Circuit Type: Silicon Gate
• Current, Supply: 160 μA
• Function Type: 8-Channels
• Logic Function: Transceiver
• Package Type: PDIP-20
• Special Features: Bus, Non-Inverting, Tri-State
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 4.5 to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC74HCT245ANGOS

SEATING
PLANE
−T−
20
1
20
1
G
18X
20X
E
e
B
0.25
D
F
−A−
M
T
A
S
D
B
10
20 PL
11
10
11
S
0.25 (0.010)
A1
B
E
N
A
A
B
T
PACKAGE DIMENSIONS
SEATING
PLANE
PLASTIC DIP PACKAGE
K
M
MC74HCT245A
C
T
CASE 738−03
CASE 751D−05
A
N SUFFIX
DW SUFFIX
PDIP−20
ISSUE E
SOIC−20W
M
ISSUE G
7
C
J
L
20 PL
0.25 (0.010)
q
M
M
T
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
B
PER ASME Y14.5M, 1994.
PROTRUSION.
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
M
DIM
A1
A
B
C
D
H
E
e
h
L
q
NOTES:
12.65
10.05
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
4. DIMENSION B DOES NOT INCLUDE MOLD
MILLIMETERS
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
1.27 BSC
0
Y14.5M, 1982.
FORMED PARALLEL.
FLASH.
DIM
_
A
B
C
D
E
G
K
M
N
F
J
L
12.95
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
1.010
0.240
0.150
0.015
0.050
0.008
0.020
0.110
MIN
7
0.050 BSC
0.100 BSC
0.300 BSC
0
_
INCHES
_
1.070
0.260
0.180
0.022
0.070
0.015
0.140
0.040
MAX
15
_
25.66
MILLIMETERS
MIN
6.10
3.81
0.39
1.27
0.21
2.80
0.51
1.27 BSC
2.54 BSC
7.62 BSC
0
_
MAX
27.17
6.60
4.57
0.55
1.77
0.38
3.55
1.01
15
_