CM2500DY-24S Powerex Inc, CM2500DY-24S Datasheet - Page 4

• Manufacturer Part Number: CM2500DY-24S
• Manufacturer: Powerex Inc
• Type: IGBT Moduler

Specifications of CM2500DY-24S

• Prx Availability: RequestQuote
• Voltage: 1200V
• Current: 2500A
• Circuit Configuration: Dual
• Rohs Compliant: Yes
• Recommended Gate Driver: VLA539
• Recommended Dc To Dc Converter: VLA539

4
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone] www.pwrx.com
CM2500DY-24S
Dual Half-Bridge IGBTMOD™ HVIGBT Module
2500 Amperes/1200 Volts
Electrical Characteristics, T
NTC Thermistor Part
Characteristics
Zero Power Resistance
Deviation of Resistance
B Constant
Power Dissipation
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Contact Thermal Resistance,
Case to Heatsink
Mechanical Characteristics
Mounting Torque
Creepage Distance
Clearance
Weight
Flatness of Baseplate
Recommended Operating Conditons, T
DC Supply Voltage
Gate-Emitter Drive Voltage
External Gate Resistance
*2 Case temperature (T
*5 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
*7 B
*8 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*9 When using liquid cooling, actual R
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
R
R
(25/50)
25
50
; Resistance at Absolute Temperature T
; Resistance at Absolute Temperature T
= In(
HEATSINK SIDE
R
R
50
25
HEATSINK SIDE
)/(
*2, *9
T
C
25
1
) and heatsink temperature (T
–
T
50
1
)
Y
X
th(c-s)
- CONCAVE
+ CONVEX
should be used by measurement on each heatsink.
Y
X
25
50
j
[K]; T
[K]; T
= 25°C unless otherwise specified (continued)
*2
*2
25
50
Y
X
s
) is measured on the surface
= 25 [°C] + 273.15 = 298.15 [K]
= 50 [°C] + 273.15 = 323.15 [K]
R
R
B
V
Y
Symbol
R
X
∆R/R
th(j-c)
th(j-c)
GE(on)
(25/50)
V
R
P
th(c-f)
M
R
M
d
d
e
m
CC
25
25
s
a
c
G
s
t
a
Q
D
= 25°C
Y
X
Approximate by Equation
T
Auxiliary Terminals, M4 Screw
Applied Across G-E Terminals
Applied Across P-N Terminals
C
Main Terminals, M6 Screw
Thermal Grease Applied
= 100°C, R
Per Inverter FWDi
Per Inverter IGBT
Terminal to Baseplate
Terminal to Baseplate
Mounting, M5 Screw
Terminal to Terminal
Terminal to Terminal
On Centerline X, Y
Test Conditions
(Per 1 Module)
T
T
C
C
Per Switch
= 25°C
= 25°C
100
*2
*2
Di2
Tr2
= 493Ω
Tr2
Di2
Each mark points to the center position of each chip.
Tr1P / Tr2: IGBT
*8
Di1
Tr1
Di1
Tr1
*5
*7
Di2
Tr2
Tr2
Di2
Di1
Tr1
Di1
Tr1
Di1 / Di2: FWDi
Tr2
Di2
Tr2
Di2
Min.
4.85
13.5
-7.3
-50
31
12
22
16
25
16
24
—
—
—
—
—
—
—
0
Di1
Tr1
Di1
Tr1
Tr2
Di2
Di2
Tr2
3375
2000
5.00
15.0
Typ.
600
3.1
35
13
27
Di1
—
—
—
—
—
—
—
—
—
—
Tr1
Di1
Tr1
Tr2
Di2
Tr2
Di2
Th
Di1
Tr1
Di1
Tr1
+100
Max.
5.15
16.5
+7.8
850
27
40
31
—
10
16
—
15
—
—
—
—
—
2
LABEL SIDE
96.2
82.7
54.2
40.7
24.5
0
4/12 Rev. 0
Grams
K/kW
K/kW
K/kW
101.2
87.7
59.2
45.7
Units
Volts
Volts
mW
in-lb
in-lb
in-lb
mm
mm
mm
mm
µm
kΩ
%
K
Ω