VND5050KE STMICRO, VND5050KE Datasheet - Page 24

• Manufacturer Part Number: VND5050KE
• Manufacturer: STMICRO

Package and PCB thermal data
4
4.1
Note:
24/37
Package and PCB thermal data
PowerSSO-12™ thermal data
Figure 31. PowerSSO-12™ PC board
Layout condition of R
area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70μm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
Figure 32. R
RTHj _amb( ° C/ W)
70
65
60
55
50
45
40
35
30
0
on)
thj-amb
th
vs PCB copper area in open box free air condition (one channel
and Z
2
th
Doc ID 12266 Rev 6
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heat sink area ( cm^ 2)
4
2
).
6
VND5050J-E / VND5050K-E
8
10