CPC7557 IXYS, CPC7557 Datasheet - Page 4

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CPC7557

Manufacturer Part Number
CPC7557
Description
Diode Bridges
Manufacturer
IXYS
Datasheet
3 Manufacturing Information
3.1 Moisture Sensitivity
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
3.2 ESD Sensitivity
3.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
3.4 Board Wash
Clare recommends the use of no-clean flux formulations. However, board washing to remove flux residue is
acceptable. The use of a short drying bake may be necessary if a wash is used after solder reflow processes.
Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic
energy should not be used.
R02
Pb
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
2002/95/EC
RoHS
e
3
CPC7557N
CPC7557N
Device
Device
www.clare.com
Moisture Sensitivity Level (MSL) Rating
Maximum Temperature x Time
260C for 30 seconds
MSL 1
CPC7557
4

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