DNA30EM2200PC IXYS, DNA30EM2200PC Datasheet
![no-image](/images/manufacturer_photos/0/3/352/ixys_sml.jpg)
DNA30EM2200PC
Specifications of DNA30EM2200PC
Related parts for DNA30EM2200PC
DNA30EM2200PC Summary of contents
Page 1
... I max. forward surge current FSM I²t value for fusing C junction capacitance J IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved Applications: ● Diode for main rectification ● For single and three phase bridge configurations ...
Page 2
... Ordering DNA 30 EM 2200 PC Standard IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved Conditions per terminal Part Name Marking on Product DNA30EM2200PC Similar Part Package DNA30E2200PC TO-263AB (D2Pak) DNA30E2200PA TO-220AC (2) DNA30E2200FE i4-Pac (2HV) Data according to IEC 60747and per diode unless otherwise specified ...
Page 3
... Outlines TO-263 (D2Pak 10.92 (0.430) 1.78 (0.07) 2.54 (0.100) IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved A Supplier Option Data according to IEC 60747and per diode unless otherwise specified DNA 30 EM 2200 PC 20110520a ...
Page 4
... Fig. 4 Power dissipation vs. direct output current & ambient temperature, sine 180° 0.8 0.6 Z thJC 0.4 [K/W] 0.2 0.0 0.001 0.01 Fig. 6 Transient thermal impedance junction to case IXYS reserves the right to change limits, conditions and dimensions. © 2011 IXYS all rights reserved 400 300 I FSM 200 [A] 100 0 2.5 0.001 ...