GMM3x100-01X1-SMD IXYS, GMM3x100-01X1-SMD Datasheet
GMM3x100-01X1-SMD
Manufacturer Part Number
GMM3x100-01X1-SMD
Description
Manufacturer
IXYS
Datasheet
1.GMM3X100-01X1-SMD.pdf
(3 pages)
Specifications of GMM3x100-01X1-SMD
Vdss, Max, (v)
100
Id25, Tc = 25°c, (a)
90
Id80, Tc = 80°c, (a)
-
Id90, Tc = 90°c, (a)
68
Rds(on), Max, Tj = 25°c, (mohms)
8.5
Tf, Typ, (ns)
55
Tr, Typ, (ns)
95
Rthjc, Max, (ºc/w)
1.0
Package Style
ISOPLUS-DIL
Three phase full Bridge
with Trench MOSFETs
in DCB isolated high current package
IXYS reserves the right to change limits, test conditions and dimensions.
© 2011 IXYS All rights reserved
MOSFETs
Symbol
V
V
I
I
I
I
Symbol
R
V
I
I
Q
Q
Q
t
t
t
t
E
E
E
R
R
1)
DSS
GSS
D25
D90
F25
F90
d(on)
r
d(off)
f
GS(th)
GS
on
off
recoff
V
DSS
DSon
thJC
thJH
g
gs
gd
DS
= I
1)
D
·(R
DS(on)
Conditions
T
T
T
T
T
Conditions
on chip level at
V
V
V
V
V
inductive load
V
I
T
with heat transfer paste (IXYS test setup)
D
J
VJ
C
C
C
C
GS
DS
DS
GS
GS
GS
= 70 A; R
= 125°C
= 25°C
= 90°C
= 25°C (diode)
= 90°C (diode)
+ 2R
= 25°C to 150°C
= V
= 10 V
= 20 V; I
= ± 20 V; V
= 10 V; V
= 10 V; V
DSS
Pin to Chip
; V
G
D
GS
DS
DS
)
= 33 Ω;
= 1 mA
DS
= 0 V
= 65 V; I
= 48 V
= 0 V
D
= 90 A
T
T
T
T
VJ
VJ
VJ
VJ
(T
= 25°C
= 125°C
= 25°C
= 125°C
VJ
G2
S2
G1
S1
= 25°C, unless otherwise specified)
min.
2.5
L1+
L1-
G3
L1
G4
S4
S3
Characteristic Values
0.007
Maximum Ratings
typ.
130
290
7.5
0.1
0.4
0.4
1.3
14
90
30
30
95
55
L2
L2+
G5
L2-
S5
G6
S6
max.
± 20
100
8.5
4.5
0.2
1.0
1.6
90
68
90
68
1
K/W
K/W
mW
mW
mA
mJ
mJ
mJ
nC
nC
nC
µA
µA
L3+
L3-
ns
ns
ns
ns
L3
V
V
A
A
A
A
V
V
I
R
Applications
AC drives
• in automobiles
• in industrial vehicles
• in battery supplied equipment
Features
• MOSFETs in trench technology:
• package:
• Space and weight savings
D25
- electric power steering
- starter generator
- propulsion drives
- fork lift drives
- low R
- optimized intrinsic reverse diode
- high level of integration
- high current capability
- aux. terminals for MOSFET control
- terminals for soldering or welding
- isolated DCB ceramic base plate
DSS
DSon typ.
connections
with optimized heat transfer
GMM 3x100-01X1
DSon
= 7.5 mW
= 100 V
= 90 A
20110307
1 - 3
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GMM3x100-01X1-SMD Summary of contents
Page 1
... E recoff R thJC R with heat transfer paste (IXYS test setup) thJH ·( DS(on) Pin to Chip IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved L1+ L2 ...
Page 2
... P pins and back side metallization Weight ·( DS(on) Pin to Chip IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Characteristic Values (T = 25°C, unless otherwise specified) J min. typ. max. 0.9 1 0.95 ...
Page 3
... Part Name & Leads Ordering Packing Unit Marking SMD Standard GMM 3x100-01X1 - SMD IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Part Marking Delivering Mode GMM 3x100-01X1 Blister GMM 3x100-01X1 Ordering Base Qty. ...