GMM3x180-004X2-SMD IXYS, GMM3x180-004X2-SMD Datasheet

GMM3x180-004X2-SMD

Manufacturer Part Number

GMM3x180-004X2-SMD

Description

Manufacturer

IXYS

Datasheet

1.GMM3X180-004X2-SMD.pdf (7 pages)

Specifications of GMM3x180-004X2-SMD

Vdss, Max, (v)

Id25, Tc = 25°c, (a)

180

Id80, Tc = 80°c, (a)

Id90, Tc = 90°c, (a)

136

Rds(on), Max, Tj = 25°c, (mohms)

2.5

Tf, Typ, (ns)

170

Tr, Typ, (ns)

240

Rthjc, Max, (ºc/w)

1.0

Package Style

ISOPLUS-DIL

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Preliminary data

Three phase full Bridge

with Trench MOSFETs

in DCB isolated high current package

IXYS reserves the right to change limits, test conditions and dimensions.

MOSFETs

Symbol

DSS

GSS

D25

D90

D110

F25

F90

F110

d(on)

d(off)

GS(th)

off

recoff

DSS

DSon

thJC

thJH

= I

·(R

DS(on)

Conditions

on chip level at

inductive load

with heat transfer paste (IXYS test setup)

= 135 A; R

= 125°C

= 25°C

= 90°C

= 110°C

= 25°C (diode)

= 90°C (diode)

= 110°C (diode)

+ R

= 25°C to 150°C

= V

= 10 V

= 20 V; I

= ± 20 V; V

= 10 V; V

= +10/0 V; V

Pin to Chip

DSS

; V

)

= 1 mA

= 39 Ω;

= 0 V

= 20 V; I

= 0 V

= 15 V

= 100 A

= 25°C

= 125°C

= 25°C

= 125°C

= 25°C, unless otherwise specified)

min.

2.5

L1+

L1-

Characteristic Values

0.003

Maximum Ratings

0.12

0.51

typ.

110

150

240

350

170

1.9

2.8

1.3

L2+

L2-

max.

± 20

180

136

120

182

112

2.5

5.3

4.5

0.2

1.0

1.6

K/W

µA

L3+

L3-

Applications

AC drives

• in automobiles

• in industrial vehicles

• in battery supplied equipment

Features

• MOSFETs in trench technology:

• package:

• Space and weight savings

D25

- electric power steering

- starter generator

- propulsion drives

- fork lift drives

- low R

- optimized intrinsic reverse diode

- high level of integration

- high current capability

- aux. terminals for MOSFET control

- terminals for soldering or welding

- isolated DCB ceramic base plate

DSS

DSon typ.

connections

with optimized heat transfer

GMM 3x180-004X2

DSon

= 1.9 mW

= 40 V

= 180 A

20110307b

1 - 7

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GMM3x180-004X2-SMD Summary of contents

Page 1

... E recoff R thJC R with heat transfer paste (IXYS test setup) thJH ·( DS(on) Pin to Chip IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved L1+ L2 ...

Page 2

... P pins and back side metallization Weight ·( DS(on) Pin to Chip IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Characteristic Values (T = 25°C, unless otherwise specified) J min. typ. max. 0.9 1.2 38 0.31 14 ...

Page 3

... Part Name & Leads Ordering Packing Unit Marking SMD Standard GMM 3x180-004X2 - SMD IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved Part Marking Delivering Mode GMM 3x180-004X2 Blister GMM 3x180-004X2 Ordering Base Qty. ...

Page 4

Page 5

... DS(on) norm. 1.0 R normalized DS(on) 0.5 0.0 - [°C] VJ Fig. 5 Typ. drain source on-state resistance R versus junction temperature T IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved I D [A] 75 100 125 150 DSS VJ = 25° 6 [A] 5 ...

Page 6

... E x10 rec(on) 0 [Ω] G Fig. 11 Typ. turn-on energy & switching times vs. gate resistor, inductive switching IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 200 180 160 140 120 I D 100 [ ...

Page 7

... F Fig. 15 Typ. reverse recovery charge Q of the body diodes versus di/dt Fig. 17 Definition of switching times IXYS reserves the right to change limits, test conditions and dimensions. © 2011 IXYS All rights reserved 125° ...

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