TB62747AFNG Toshiba, TB62747AFNG Datasheet - Page 19

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TB62747AFNG

Manufacturer Part Number
TB62747AFNG
Description
Manufacturer
Toshiba
Datasheet

Specifications of TB62747AFNG

Package
VSOP24
# Outputs
16
Vout Max
26V
Io
1.5 to 45mA
Io Accuracy
±1.5%
Features Error Detection
-
Features Gain Control
-
Features Pwm Dimming
-
Other Features & Functions
Available in small QSOP24 package (outside Japan)
Rohs Compatible Product(s) (#)
Available

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TB62747AFNG(O,EL)
Manufacturer:
STM
Quantity:
1 956
Company:
Part Number:
TB62747AFNG(O,EL)
Quantity:
8 985
IC Usage Considerations
[1]
[2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of
[3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
[4] Do not insert devices in the wrong orientation or incorrectly.
[5] Carefully select external components (such as inputs and negative feedback capacitors) and load
Points to remember on handling of ICs
(1) Heat Radiation Design
(2)
Notes on handling of ICs
The
Back-EMF
even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury
by explosion or combustion.
over current and/or IC failure. The IC will fully break down when used under conditions that exceed its
absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs
from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or
ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings,
such as fuse capacity, fusing time and insertion circuit location, are required.
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF. IC
breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the
protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or
ignition.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding
the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation or
incorrectly even just one time.
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC output
DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage,
overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from
the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC
that inputs output DC voltage to a speaker directly.
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (T
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown.
In addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the
device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid
this problem, take the effect of back-EMF into consideration in system design.
absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded,
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TB62747AFG/AFNG/AFNAG/BFNAG
2009-01-21
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