NLU1GT50MUTCG ON Semiconductor, NLU1GT50MUTCG Datasheet - Page 7

• Manufacturer Part Number: NLU1GT50MUTCG
• Description: IC BUFFER TTL NON-INVERT 6UDFN
• Manufacturer: ON Semiconductor

Specifications of NLU1GT50MUTCG

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Current - Output High, Low: 8mA, 8mA
• Voltage - Supply: 1.65 V ~ 3.6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 6-UFDFN
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.65 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 8 mA
• Low Level Output Current: 8 mA
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 1 / 1
• Propagation Delay Time: 19.5 ns at 2.3 V to 2.7 V, 13.5 ns at 3 V to 3.6 V, 7.7 ns at 4.5 V to 5.5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NLU1GT50MUTCGOSTR

6X
REFERENCE
PIN ONE
0.10 C
0.05 C
0.05 C
0.10 C
L1
É É
É É É É
BOTTOM VIEW
SIDE VIEW
TOP VIEW
1
6
D
4
A1
3
e
6X
E
A
B
A
b
5X
0.10
0.05
C
L
SEATING
PLANE
NOTE 4
C
C
PACKAGE DIMENSIONS
A
NOTE 3
ULLGA6 1.2x1.0, 0.4P
B
http://onsemi.com
CASE 613AE-01
NLU1GT50
ISSUE A
7
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.53
SOLDERMASK DEFINED*
MOUNTING FOOTPRINT
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
4. A MAXIMUM OF 0.05 PULL BACK OF THE
OUTLINE
ASME Y14.5M, 1994.
AND IS MEASURED BETWEEN 0.15 AND
0.30 mm FROM THE TERMINAL TIP.
PLATED TERMINAL FROM THE EDGE OF THE
PACKAGE IS ALLOWED.
PKG
DIM
0.49
A1
L1
A
D
E
b
e
L
5X
1
MILLIMETERS
MIN
0.00
0.15
0.25
0.35
---
1.20 BSC
1.00 BSC
0.40 BSC
DIMENSIONS: MILLIMETERS
MAX
0.40
0.05
0.25
0.35
0.45
PITCH
1.24
0.40
0.26
6X