MC74VHC1G07DTT1G ON Semiconductor, MC74VHC1G07DTT1G Datasheet - Page 6

• Manufacturer Part Number: MC74VHC1G07DTT1G
• Description: IC BUFFER NON-INV O/DRAIN SOT235
• Manufacturer: ON Semiconductor
• Series: 74VHCr

Specifications of MC74VHC1G07DTT1G

• Logic Type: Buffer/Line Driver, Non-Inverting
• Number Of Elements: 1
• Number Of Bits Per Element: 1
• Voltage - Supply: 2 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-5, TSOT-5, TSOP-5
• Logic Family: VHC
• Number Of Channels Per Chip: 1
• Polarity: Non-Inverting
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Low Level Output Current: 8 mA
• Maximum Power Dissipation: 150 mW
• Minimum Operating Temperature: - 55 C
• Number Of Lines (input / Output): 1 / 1
• Output Type: Open Drain
• Propagation Delay Time: 10.6 ns at 3.3 V, 7.5 ns at 5 V
• Logical Function: Buffer/Driver
• Number Of Elements: 1
• Number Of Channels: 1
• Number Of Inputs: 1
• Number Of Outputs: 1
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: TSOP
• High Level Output Current: 8mA
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2V
• Quiescent Current: 1uA
• Technology: CMOS
• Pin Count: 5
• Mounting: Surface Mount
• Operating Temp Range: -55C to 125C
• Operating Temperature Classification: Military
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output High, Low: -
• Lead Free Status / Rohs Status: Details
• Other names: MC74VHC1G07DTT1GOS; MC74VHC1G07DTT1GOS; MC74VHC1G07DTT1GOSTR

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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
H
1
5
A
2
G
4
3
C
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
0.039
1.0
C A B
0.037
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.95
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
http://onsemi.com
MC74VHC1G07
J
CASE 483−02
K
TSOP−5
ISSUE F
0.074
1.9
DETAIL Z
6
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
DIM
inches
A
B
C
D
G
H
K
M
J
L
S
mm
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_
MC74VHC1G07/D