MAX4888C Maxim, MAX4888C Datasheet - Page 2

• Manufacturer Part Number: MAX4888C
• Description: The MAX4888B/MAX4888C dual double-pole/double-throw (2 x DPDT), high-speed passive switches are ideal for switching two half-lanes of PCI Express® (PCIe) data between two possible destinations
• Manufacturer: Maxim

Note 1: Signals on SEL, SELB, AIN_, BIN _, AOUTA_, AOUTB_, BOUTA_, and BOUTB_ exceeding V
PACKAGE THERMAL CHARACTERISTICS (Note 2)
TQFN
Up to 8.0Gbps Dual Passive Switches
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND, unless otherwise noted.)
V
SEL, SELB, AIN+, AIN-, BIN+, BIN-, AOUTA+,
Continuous Current (AIN_ to AOUTA_/AOUTB_,
Peak Current (AIN_ to AOUTA_/AOUTB_,
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(V
noted.) (Note 3)
2
DC PERFORMANCE
Analog-Signal Range
On-Resistance
On-Resistance Match
Between Channels
On-Resistance Flatness
_OUTA_ or _OUTB_
Off-Leakage Current
AIN_, BIN_ On-Leakage Current
Output Short-Circuit Current
Output Open-Circuit Voltage
CC
Junction-to-Ambient Thermal Resistance (q
Junction-to-Case Thermal Resistance (q
CC
AOUTA-, AOUTB+, AOUTB-, BOUTA+,
BOUTA-, BOUTB+, BOUTB- (Note 1) .. -0.3V to (V
BIN_ to BOUTA_/BOUTB_) .......................................... Q15mA
BIN_ to BOUTA_/BOUTB_)
(pulsed at 1ms, 10% duty cycle) ................................ Q70mA
..........................................................................-0.3V to +4V
= 3.3V Q10%, T
internal diodes. Limit forward-diode current to maximum current rating.
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
A
= -40NC to +85NC
I_
I_
R
OUTA_(OFF),
I
SYMBOL
OUTB_(OFF)
I
AIN_(ON),
BIN_(ON)
FLAT(ON)
V
DR
R
INPUT
,
ON
ON
JC
unless otherwise noted. Typical values are at V
) .................2°C/W
JA
) ..........35°C/W
AIN_, BIN_, AOUTA_, BOUTA_, AOUTB_,
BOUTB_
V
V_
V
V_
V
V_
V
V
(MAX4888B)
V
V
unconnected (MAX4888B)
All other ports are unconnected
(MAX4888C)
All other ports are unconnected
(MAX4888C)
CC
CC
CC
CC
CC
_OUTA_
CC
_OUTA_
OUTA_
OUTA_
OUTA_
+ 0.3V)
= +3.0V, I
= +3.0V, I
= +3.0V, I
= +3.6V, V
= +3.6V , V
or V
or V
= V_
= V_
= V_
_OUTB_
_OUTB_
OUTB_
OUTB_
OUTB_
CONDITIONS
AIN_
AIN_
AIN_
AIN_
AIN_
Continuous Current (SEL, SELB) .................................... Q10mA
Peak Current (SEL, SELB)
Continuous Power Dissipation (T
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
= I
= I
= I
(pulsed at 1ms, 10% duty cycle) ................................ Q10mA
TQFN (derate 28.6mW/NC above +70NC)..................2286mW
= V
= 0V, 1.2V
= 0V (Note 4)
= 0V, 1.2V (Note 5)
= V
= 1.2V, 0V
= V
BIN_
BIN_
BIN_
BIN_
BIN_
AIN_
= 15mA,
= 15mA,
= 15mA,
= 0V, 1.2V;
= 0V, 1.2V;
= V
BIN_
or
CC
= 3.3V, T
MIN
-0.3
0.2
-1
-1
5
A
CC
A
= +70NC)
or GND are clamped by
= +25NC, unless otherwise
TYP
6.4
0.2
0.3
0.6
V
MAX
CC
1.8
8.4
1.5
0.9
+1
+1
15
1
-
UNITS
FA
FA
FA
I
I
I
V
V