MAX44261 Maxim, MAX44261 Datasheet - Page 2

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MAX44261

Manufacturer Part Number
MAX44261
Description
The MAX44260/MAX44261 offer a unique combination of high speed, precision, low noise, and low-voltage operation making them ideally suited for a large number of signal processing functions such as filtering and amplification of signals in portable an
Manufacturer
Maxim
Datasheet
ABSOLUTE MAXIMUM RATINGS
IN+, IN-, OUT .................................(V
V
SHDN, CAL .............................................................-0.3V to +6V
Output to Short-Circuit Ground Duration .............................. 10s
Continuous Input Current into Any Pin ............................ Q20mA
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
SC70
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
at T
DD
DC CHARACTERISTICS
Input Voltage Range
Input Offset Voltage
Input Offset Voltage Drift
Input Bias Current
Input Capacitance
Common-Mode Rejection Ratio
Open-Loop Gain
Output Short-Circuit Current
DD
SC70 (derate 3.1mW/NC above +70NC) ......................245mW
Junction-to-Ambient Thermal Resistance (B
Junction-to-Case Thermal Resistance (B
A
to V
= 3.3V, V
= +25NC, unless otherwise noted.) (Note 2)
SS
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
...............................................................-0.3V to +6V
SS
= 0V, V
_________________________________________________________________ Maxim Integrated Products 2
IN+
= V
A
IN-
= +70NC)
= V
SS
SYMBOL
V
V
Low-Power, Rail-to-Rail I/O Op Amps
IN+
CMRR
OS
V
A
DD
C
I
- 0.3V) to (V
SC
I
OS
OL
B
IN
- TC
V
JC
/2, R L = 10kI to V
IN-
) .............115NC/W
JA
) .... 326.5NC/W
Guaranteed by CMRR test
T
T
T
T
T
T
V
0.4V P V
0.4V P V
0.4V P V
To V
A
A =
A
A
A
A
CM
DD
= -40C to +125C
= +25NC
= +25NC
= -40NC to +85NC
= -40NC to +125NC
DD
-40C to +125C after calibration
= -0.1V to (V
+ 0.3V)
or V
OUT
OUT
OUT
DD
SS
P V
P V
P V
CONDITIONS
/2, V
DD
DD
DD
DD
CAL
Operating Temperature Range ........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Thin μDFN (Ultra-Thin LGA)
- 0.4V, R
- 0.4V, R
- 0.4V, R
1.8V 15MHz Low-Offset,
+ 0.1V)
6-Pin Thin μDFN (Ultra-Thin LGA)
(derate 2.1mW/NC above +70NC) .............................110.2mW
Junction-to-Ambient Thermal Resistance (B
= V
MAX44260/MAX44261
SHDN
OUT
OUT
OUT
= 32I
= 10kI
= 600I
= V
DD
, T
A
= -40NC to +125NC. Typical values are
MIN
-0.1
100
75
91
TYP
0.01
115
100
0.8
0.4
10
90
80
50
+ 0.1
MAX
JA
V
100
500
100
0.5
50
10
DD
5
) ....... 470NC/W
UNITS
FV/NC
mA
FV
pA
pF
dB
dB
V

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