NCS2202SN1T1 ON Semiconductor, NCS2202SN1T1 Datasheet - Page 14

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NCS2202SN1T1

Manufacturer Part Number
NCS2202SN1T1
Description
IC COMPARATOR LV LOW PWR SOT23-5
Manufacturer
ON Semiconductor
Series
NCS2200r
Type
General Purposer
Datasheet

Specifications of NCS2202SN1T1

Number Of Elements
1
Output Type
Open-Drain, Rail-to-Rail
Voltage - Supply
0.85 V ~ 6 V
Mounting Type
Surface Mount
Package / Case
TSOT-23-5, TSOT-5, TSOP-5
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
NCS2202SN1T1OSTR

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Manufacturer
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NCS2202SN1T1
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Part Number:
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2X
2X
0.10
0.20
NOTE 5
0.05
L
T
T
1
H
5
A
2
G
4
3
C
*For additional information on our Pb−Free strategy and soldering
B
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
T
S
D
SEATING
PLANE
5X
0.20
SOT−23−5 / TSOP−5 / SC59−5
0.039
1.0
PACKAGE DIMENSIONS
C A B
0.037
0.95
SOLDERING FOOTPRINT*
PLASTIC PACKAGE
http://onsemi.com
CASE 483−02
SN SUFFIX
J
ISSUE H
K
0.074
14
1.9
DETAIL Z
0.028
0.7
DETAIL Z
M
SCALE 10:1
0.094
2.4
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. DIMENSIONS A AND B DO NOT INCLUDE
5. OPTIONAL CONSTRUCTION: AN
ASME Y14.5M, 1994.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
ADDITIONAL TRIMMED LEAD IS ALLOWED
IN THIS LOCATION. TRIMMED LEAD NOT TO
EXTEND MORE THAN 0.2 FROM BODY.
inches
DIM
mm
A
B
C
D
G
H
K
M
J
L
S
MILLIMETERS
MIN
0.90
0.25
0.01
0.10
0.20
1.25
2.50
3.00 BSC
1.50 BSC
0.95 BSC
0
_
MAX
1.10
0.50
0.10
0.26
0.60
1.55
10
3.00
_

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