LMV393DMR2G ON Semiconductor, LMV393DMR2G Datasheet - Page 17
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LMV393DMR2G
Manufacturer Part Number
LMV393DMR2G
Description
IC COMPARATOR GP LV DUAL MICRO8
Manufacturer
ON Semiconductor
Type
General Purposer
Datasheet
1.LMV331SQ3T2G.pdf
(21 pages)
Specifications of LMV393DMR2G
Number Of Elements
2
Output Type
Open Drain
Voltage - Supply
2.7 V ~ 5 V
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LMV393DMR2G
Manufacturer:
ON Semiconductor
Quantity:
6 550
Part Number:
LMV393DMR2G
Manufacturer:
ON/安森美
Quantity:
20 000
−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
H
E
e
D D
A1
A
b
*For additional information on our Pb−Free strategy and soldering
E
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
8 PL
0.08 (0.003)
8X
c
0.041
1.04
6X
M
0.0256
0.65
0.126
PACKAGE DIMENSIONS
3.20
SOLDERING FOOTPRINT*
T
B
http://onsemi.com
S
CASE 846A−02
A
Micro8t
ISSUE H
L
S
17
0.015
0.38
8X
0.167
SCALE 8:1
4.24
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DIM
H
A1
A
b
c
D
E
e
L
E
0.208
5.28
inches
0.05
0.25
0.13
2.90
2.90
0.40
4.75
MIN
mm
−−
MILLIMETERS
0.65 BSC
NOM
0.08
0.33
0.18
3.00
3.00
0.55
4.90
−−
MAX
1.10
0.15
0.40
0.23
3.10
3.10
0.70
5.05
0.002
0.010
0.005
0.016
0.187
0.114
0.114
MIN
−−
0.026 BSC
INCHES
0.003
0.013
0.007
0.118
0.118
0.021
0.193
NOM
−−
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
MAX