4-1674770-1 TE Connectivity, 4-1674770-1 Datasheet

4-1674770-1

Manufacturer Part Number

4-1674770-1

Description

Manufacturer

TE Connectivity

Datasheets

1.1-1674770-5.pdf (3 pages)

2.2-1674770-1.pdf (9 pages)

Specifications of 4-1674770-1

Insertion Force

ZIF

Pcb Mount Style

Surface Mount

Grid Size

26x26

Grid Spacing (mm [in])

1.27 x 1.27 [.050 x .050]

Chip Compatibility

Intel® Pentium® 4 (mPGA479M pattern)

Frame Style

Open

Heat Sink Attachment

Without

Zif Actuator

Screwdriver/Cam

Profile

Low

Cover Material

High Temperature Thermoplastic

Leg Style

Ball Grid Array (BGA)

Socket Identifier

mPGA479M

Socket Overall Height (mm [in])

3 [0.118]

Number Of Positions

479

Assembly Process Feature

Pick and Place Cover, Tape

Cover Color

Black

Contact Style

Stamped + Formed

Contact Base Material

Copper Alloy

Contact Plating, Mating Area, Material

Gold (30)

Housing Color

Black

Housing Material

High Temperature Thermoplastic

Ul Flammability Rating

UL 94V-0

Housing Material Temperature

High

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C

Rohs/elv Compliance History

Always was RoHS compliant

Application

Production

Packaging Method

JEDEC Hard Tray

Packaging Quantity

600 sockets/box

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

4-1674770-1

Manufacturer:

JST

Quantity:

457

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