MCP6549-E/P Microchip Technology, MCP6549-E/P Datasheet - Page 22
![IC COMP 1.6V QUAD O-D 14DIP](/photos/6/59/65935/150-14-dip_sml.jpg)
MCP6549-E/P
Manufacturer Part Number
MCP6549-E/P
Description
IC COMP 1.6V QUAD O-D 14DIP
Manufacturer
Microchip Technology
Type
General Purposer
Specifications of MCP6549-E/P
Output Type
CMOS, Open-Drain, Rail-to-Rail, TTL
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Elements
4
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Through Hole
Number Of Channels
4 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MCP6546/6R/6U/7/8/9
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
DS21714E-page 22
Note:
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
B
c
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
n
45°
β
Dimension Limits
§
E1
E
Units
A2
E1
A1
A
E
D
B
n
p
h
L
φ
c
α
β
MIN
h
.053
.052
.004
.228
.146
.189
.010
.019
.008
.013
2
1
0
0
0
L
D
φ
INCHES*
NOM
8
.050
.056
.007
.237
.154
.193
.015
.025
.009
.017
.061
12
12
4
A
A1
MAX
.069
.010
.244
.157
.197
.020
.030
.010
.020
.061
15
15
8
MIN
1.35
0.25
1.32
0.10
5.79
4.80
0.48
0.20
0.33
3.71
0
0
0
MILLIMETERS
NOM
8
© 2006 Microchip Technology Inc.
1.27
1.55
1.42
0.18
6.02
4.90
0.38
0.62
0.23
0.42
3.91
12
12
α
4
MAX
A2
1.75
1.55
0.25
6.20
3.99
5.00
0.76
0.25
0.51
0.51
15
15
8