MCP6547-E/P Microchip Technology, MCP6547-E/P Datasheet - Page 19

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MCP6547-E/P

Manufacturer Part Number
MCP6547-E/P
Description
IC COMP 1.6V DUAL O-D 8DIP
Manufacturer
Microchip Technology
Type
General Purposer
Datasheets

Specifications of MCP6547-E/P

Output Type
CMOS, Open-Drain, Rail-to-Rail, TTL
Package / Case
8-DIP (0.300", 7.62mm)
Number Of Elements
2
Voltage - Supply
1.6 V ~ 5.5 V
Mounting Type
Through Hole
Number Of Channels
2 Channels
Product
Analog Comparators
Offset Voltage (max)
7 mV
Input Bias Current (max)
0.000001 uA
Supply Voltage (max)
5.5 V
Supply Voltage (min)
1.6 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
5-Lead Plastic Package (LT) (SC-70)
© 2006 Microchip Technology Inc.
Note:
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Top of Molded Pkg to
Lead Shoulder
Lead Thickness
Lead Width
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
JEITA (EIAJ) Standard: SC-70
Drawing No. C04-061
c
See ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
p
Q1
n
Dimension Limits
E1
E
Units
A2
Q1
E1
A1
n
p
A
E
D
L
c
B
MIN
1
.004
.004
.004
.000
.045
.006
.031
.031
.071
.071
B
.026 (BSC)
INCHES
L
NOM
D
5
MCP6546/6R/6U/7/8/9
A2
A1
MAX
.043
.004
.094
.053
.087
.012
.016
.007
.012
.039
MIN
0.80
0.80
0.00
1.80
1.15
1.80
0.10
0.10
0.10
0.15
MILLIMETERS*
0.65 (BSC)
NOM
5
Revised 07-19-05
DS21714E-page 19
MAX
1.10
1.00
0.10
2.40
1.35
2.20
0.30
0.40
0.18
0.30
A

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