LM393NG ON Semiconductor, LM393NG Datasheet - Page 9

• Manufacturer Part Number: LM393NG
• Description: IC COMP DUAL OFFSET LV 8DIP
• Manufacturer: ON Semiconductor
• Type: General Purposer

Specifications of LM393NG

• Number Of Elements: 2
• Output Type: CMOS, DTL, ECL, MOS, Open-Collector, TTL
• Voltage - Supply: 2 V ~ 36 V, ±1 V ~ 18 V
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Number Of Channels: 2 Channels
• Response Time: 1.5 us
• Offset Voltage (max): 5 mV
• Input Bias Current (max): 250 nA
• Supply Voltage (max): 36 V
• Supply Voltage (min): 2 V
• Supply Current (max): 1 mA
• Maximum Power Dissipation: 570 mW
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: 0 C
• Amplifier Type: Comparator
• Current, Input Bias: 25 nA
• Current, Input Offset: ±5 nA
• Current, Supply: 0.4 mA
• Number Of Amplifiers: Dual
• Package Type: PDIP-8
• Power Dissipation: 570 mW
• Temperature, Operating, Range: 0 to +70 °C
• Voltage, Gain: 200 V/mV
• Voltage, Input Offset: ±1 mV
• Voltage, Supply: ±1 to ±18 VDC
• Comparator Type: Precision
• No. Of Comparators: 2
• Ic Output Type: CMOS, MOS, TTL, DTL, ECL
• Supply Current: 400µA
• Supply Voltage Range: ± 1V To ± 18V
• Amplifier Case Style: DIP
• Rohs Compliant: Yes
• Number Of Elements: 2
• Technology: Bipolar
• Input Offset Voltage: 5mV
• Input Bias Current (typ): 250nA
• Single Supply Voltage (typ): 3/5/9/12/15/18/24/28V
• Dual Supply Voltage (typ): ±3/±5/±9/±12/±15V
• Power Supply Requirement: Single/Dual
• Voltage Gain In Db: 106.02dB
• Single Supply Voltage (min): 2V
• Single Supply Voltage (max): 36V
• Dual Supply Voltage (min): ±1V
• Dual Supply Voltage (max): ±18V
• Operating Temp Range: 0C to 70C
• Operating Temperature Classification: Commercial
• Mounting: Through Hole
• Pin Count: 8
• Output Compatibility: CMOS, DTL, ECL, MOS, TTL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: LM393NGOS

−Z−
−Y−
B
H
−X−
8
1
0.25 (0.010)
G
A
D
5
4
M
Z
S
*For additional information on our Pb−Free strategy and soldering
Y
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
S
C
0.25 (0.010)
X
SEATING
PLANE
S
0.024
0.6
0.10 (0.004)
0.275
7.0
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
M
Y
http://onsemi.com
M
N
CASE 751−07
SOIC−8 NB
X 45
D SUFFIX
ISSUE AJ
_
M
9
K
SCALE 6:1
0.060
0.155
1.52
4.0
1.270
0.050
J
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
STANDARD IS 751−07.
DIM
M
A
B
C
D
G
H
K
N
S
J
MILLIMETERS
MIN
4.80
3.80
1.35
0.33
0.10
0.19
0.40
0.25
5.80
0
1.27 BSC
_
MAX
5.00
4.00
1.75
0.51
0.25
0.25
1.27
0.50
6.20
8
_
0.189
0.150
0.053
0.013
0.004
0.007
0.016
0.010
0.228
MIN
0
0.050 BSC
INCHES
_
0.197
0.157
0.069
0.020
0.010
0.010
0.050
0.020
0.244
MAX
8
_