SA572NG ON Semiconductor, SA572NG Datasheet - Page 11

• Manufacturer Part Number: SA572NG
• Description: IC COMPANDOR 2CHAN GAIN 16-DIP
• Manufacturer: ON Semiconductor
• Type: Compandorr

Specifications of SA572NG

• Applications: Automatic Level Control, Stereo Expander
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: SA572NG; SA572NGOS

16
1
H
16
1
−A−
G
0.25
14X
16X
M
D
e
B
F
T
D
9
8
16 PL
A
0.25 (0.010)
S
B
S
B
9
8
S
K
C
M
A
B
−T−
T
T
A
SEATING
PLANE
SEATING
PLANE
PACKAGE DIMENSIONS
M
http://onsemi.com
CASE 648−08
CASE 751G−03
J
SOIC−16 WB
PDIP−16
ISSUE T
D SUFFIX
ISSUE C
C
11
L
q
M
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSIONS D AND E DO NOT INLCUDE
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
M
A
B
C
D
F
G
H
J
K
L
S
PER ASME Y14.5M, 1994.
MOLD PROTRUSION.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE B DIMENSION AT MAXIMUM
MATERIAL CONDITION.
DIM
A1
A
B
C
D
E
H
e
h
L
q
0.740
0.250
0.145
0.015
0.040
0.008
0.295
0.020
0.110
MIN
0.100 BSC
0.050 BSC
10.15
10.05
0
MILLIMETERS
INCHES
MIN
2.35
0.10
0.35
0.23
7.40
0.25
0.50
_
1.27 BSC
0
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
0.70
10
10.45
10.55
MAX
2.65
0.25
0.49
0.32
7.60
0.75
0.90
_
7
_
18.80
MILLIMETERS
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
MIN
2.54 BSC
1.27 BSC
0
_
19.55
MAX
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
10
_