ADP130 Analog Devices, ADP130 Datasheet - Page 17

• Manufacturer Part Number: ADP130
• Description: 350 mA, Low VIN, Low Quiescent Current, CMOS Linear Regulator
• Manufacturer: Analog Devices

In cases where board temperature is known, use the thermal char-
acterization parameter, Ψ
rise. Maximum junction temperature (T
board temperature (T
following formula:
The typical value of Ψ
T
J
= T
140
120
100
80
60
40
20
0
0.4
B
+ (P
MAX T
1mA
10mA
D
0.8
× Ψ
J
(DO NOT OPERATE ABOVE THIS POINT)
JB
Figure 46. TSOT, T
B
JB
) and power dissipation (P
is 42.8°C/W for the 5-lead TSOT package.
)
JB
50mA
100mA
1.2
, to estimate the junction temperature
V
IN
– V
1.6
OUT
150mA
250mA
A
= 85°C
(V)
J
) is calculated from the
2.0
(I
350mA
LOAD
D
2.4
), using the
)
2.8
Rev. B | Page 17 of 20
(5)
PCB LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP130.
However, as shown in Table 6, a point of diminishing return is
eventually reached, beyond which an increase in the copper size
does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins. The output capacitor should be placed as
close as possible to the VOUT and GND pins. Using 0402 or 0603
size capacitors and resistors achieves the smallest possible foot-
print solution on boards where the area is limited.
GND
GND
VIN
Figure 47. Example TSOT PCB Layout
EN
ANALOG DEVICES
ADP130-xx-EVALZ
J1
C1
U1
C2
VBIAS
C3
VOUT
GND
GND
ADP130