ADP8863 Analog Devices, ADP8863 Datasheet - Page 5

• Manufacturer Part Number: ADP8863
• Description: Charge Pump, 7-Channel Fun Lighting LED Driver
• Manufacturer: Analog Devices

Specifications of ADP8863

• Vin Range: 2.5 to 5.5V
• Vout (v): 4.3 to 5.5
• Synchronous: No
• Package: 20-Lead LFCSP,20-Lead WLCSP
• Led Configuration: Parallel
• Topology: Capacitive
• I2c Support: Yes
• Max Iout (ma): 60mA
• Brightness Control: I2C
• Peak Efficiency (%): 89%
• Switching Frequency: 1.32MHz
• Over Volt Protection (v): 5V

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
VIN, VOUT
D1, D2, D3, D4, D5, D6, and D7
CMP_IN
nINT, nRST, SCL, and SDA
Output Short-Circuit Duration
Operating Ambient Temperature Range
Operating Junction Temperature Range
Storage Temperature Range
Soldering Conditions
ESD (Electrostatic Discharge)
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all voltages are
referenced to ground.
The maximum operating junction temperature (T
over the maximum operating ambient temperature (T
Maximum Temperature Ranges section for more information.
Human Body Model (HBM)
Charged Device Model (CDM)
J(MAX)
) takes precedence
A(MAX)
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +6 V
Indefinite
–40°C to +85°C
–40°C to +125°C
–65°C to +150°C
JEDEC J-STD-020
±3 kV
±1.5 kV
). See the
1
Rev. A | Page 5 of 52
MAXIMUM TEMPERATURE RANGES
The maximum operating junction temperature (T
precedence over the maximum operating ambient temperature
(T
exposed to poor thermal resistance and high power dissipation
(P
derated. In these cases, the maximum ambient temperature can
be calculated with the following equation:
THERMAL RESISTANCE
θ
that is, a device soldered in a circuit board for surface-mount
packages. The θ
are determined according to JESD51-9 on a 4-layer printed
circuit board (PCB) with natural convection cooling. For the
LFCSP package, the exposed pad must be soldered to GND.
Table 3. Thermal Resistance
Package Type
WLCSP
LFCSP
1
ESD CAUTION
N/A stands for not applicable.
JA
D
A(MAX)
(junction to air) is specified for the worst-case conditions,
), the maximum ambient temperature may need to be
T
A(MAX)
). Therefore, in situations where the ADP8863 is
= T
JA
J(MAX)
, θ
JB
θ
48
49.5
JA
(junction to board), and θ
− (θ
JA
× P
θ
9
N/A
D(MAX)
JB
1
)
θ
N/A
5.3
JC
1
JC
(junction to case)
ADP8863
J(MAX)
Unit
°C/W
°C/W
) takes