ADA4853-2 Analog Devices, ADA4853-2 Datasheet - Page 19

• Manufacturer Part Number: ADA4853-2
• Description: Low Power, Rail-to-Rail Output, Video Op Amp with Ultralow Power
• Manufacturer: Analog Devices

Specifications of ADA4853-2

• -3db Bandwidth: 100MHz
• Slew Rate: 120V/µs
• Vos: 2mV
• Ib: 1µA
• # Opamps Per Pkg: 2
• Input Noise (nv/rthz): 22nV/rtHz
• Vcc-vee: 2.65V to 5V
• Isy Per Amplifier: 1.6mA
• Packages: CSP

ORDERING GUIDE
Model
ADA4853-1AKSZ-R2
ADA4853-1AKSZ-R7
ADA4853-1AKSZ-RL
ADA4853-1AKS-EBZ
ADA4853-2YCPZ-R2
ADA4853-2YCPZ-RL
ADA4853-2YCPZ-RL7
ADA4853-2YCP-EBZ
ADA4853-3YCPZ-R2
ADA4853-3YCPZ-RL
ADA4853-3YCPZ-R7
ADA4853-3WYCPZ-R7
ADA4853-3YCP-EBZ
ADA4853-3YRUZ
ADA4853-3YRUZ-RL
ADA4853-3YRUZ-R7
ADA4853-3YRU-EBZ
1
2
AUTOMOTIVE PRODUCTS
The ADA4853-3W model is available with controlled manufacturing to support the quality and reliability requirements of automotive
applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers
should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in
automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to
obtain the specific Automotive Reliability reports for these models.
Z = RoHS Compliant Part.
W = Qualified for Automotive Applications.
1
, 2
Temperature
Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
INDICATOR
SEATING
PLANE
0.90
0.85
0.80
PIN 1
12° MAX
BSC SQ
0.30
0.23
0.18
Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
VIEW
3.00
TOP
Package Description
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
6-Lead Thin Shrink Small Outline Transistor Package (SC70)
Evaluation Board
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
16-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
14-Lead Thin Shrink Small Outline Package (TSSOP)
14-Lead Thin Shrink Small Outline Package (TSSOP)
14-Lead Thin Shrink Small Outline Package (TSSOP)
Evaluation Board
* COMPLIANT TO JEDEC STANDARDS MO-220-VEED-2
3 mm × 3 mm Body, Very Thin Quad (CP-16-3)
EXCEPT FOR EXPOSED PAD DIMENSION.
BSC SQ
0.20 REF
Dimensions shown in millimeters
2.75
0.80 MAX
0.65 TYP
0.05 MAX
0.02 NOM
Rev. F | Page 19 of 20
0.45
BSC
0.50
1.50 REF
0.60 MAX
12
9
8
13
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
ADA4853-1/ADA4853-2/ADA4853-3
16
1
4
0.50
0.40
0.30
5
0.25 MIN
* 1.65
1.50 SQ
1.35
Ordering
Quantity
250
3000
10,000
1
250
5000
1500
1
250
5000
1500
1500
96
2500
1000
1
Package
Option
KS-6
KS-6
KS-6
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
CP-16-3
RU-14
RU-14
RU-14
Branding
HEC
HEC
HEC
H0H
H0H
H0H
H0L
H0L
H0L
H2H